Heat dissipation device having a fan duct thereon

• US 8,230,904 B2
• Filed: 05/27/2009
• Issued: 07/31/2012
• Est. Priority Date: 04/08/2009
• Status: Expired due to Fees

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Xu, Hong-Bo
• Primary Examiner(s): Flanigan, Allen J.
• Assistant Examiner(s): Thompson, Jason
• Application Number:
  US12/472,391
• Publication Number:
  US 20100258271A1
• Time in Patent Office: 1,161 Days
• Field of Search: 165/185, 165/80.3, 165/121, 361/704, 361/710, 361/679.47, 361/697
• US Class Current: 165/80.3
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality of laterally extending second fins located below the first fins. A plurality of first airflow channels are defined in the adjacent first fins and a plurality of second airflow channels are defined in the adjacent second fins. The fan duct guides a significant part of the airflow produced by the fan to the second airflow channels from a lateral side of the heat sink to have a sufficient contact with the second fins of the heat sink.

Claims

1. A heat dissipation device comprising:

a fan for generating airflow;

a heat sink comprising a top on which the fan is mounted, a bottom opposite to the top for contacting a heat-generating component to absorb heat, and a four lateral sides between the top and the bottom, a plurality of first fins extending upwardly towards the fan and a plurality of second fins located below tops of the first fins and extending toward two of the four lateral sides of the heat sink, the plurality of first fins defining a plurality of first airflow channels therebetween, and the plurality of second fins defining a plurality of second airflow channels therebetween; and

a fan duct located at another one of the four lateral sides of the heat sink and guiding a part of the airflow of the fan to enter the second airflow channels of the heat sink from the another one of the four lateral sides of the heat sink wherein the fan duct comprises a main body and a pair of baffles, a bottom of the main body is attached to the bottom of the heat sink at the another one of the four lateral sides of the heat sink, a top of the main body is attached to a bottom side of the fan which faces the top of the heat sink, the top of the main body is spaced from the another one of the four lateral sides of the heat sink, the baffles extend from opposite lateral edges of the main body to lateral edges of the another one of the four lateral sides of the heat sink, a space is defined between the main body, the baffles and the another one of the four lateral sides of the heat sink for the part of the airflow of the fan to pass therethrough and enter the second airflow channels of the heat sink, and the main body is inclined outwardly relative to the bottom of the heat sink.

2. The heat dissipation device of claim 1, wherein the plurality of first fins of the heat sink are vertical to the bottom of the heat sink and the plurality of second fins are parallel to each other and oriented inclinedly upward.

3. The heat dissipation device of claim 2, wherein the heat sink comprises a pair of conducting arms extending from the bottom of the heat sink and away from each other and the plurality of first fins extend from an inner surface of each of the conducting arms and the plurality of second fins extend from an outer surface of each of the conducting arms.

4. The heat dissipation device of claim 1, wherein each of the baffles of the fan duct comprises a mounting leg engaging with one bottommost second fin of the heat sink and a fixing ear engaging with a lower frame of the fan.

5. The heat dissipation device of claim 4, wherein the bottommost second fins of the heat sink each define a mounting slot engagingly receiving a corresponding mounting leg of the fan duct.

6. The heat dissipation device of claim 5, wherein the lower frame of the fan defines two through orifices, each through orifice engagingly receiving a corresponding fixing ear of the fan duct.

7. The heat dissipation device of claim 3, wherein the heat sink defines a pair of fixing slots each being at a top of each of the conducting arms.

8. The heat dissipation device of claim 7, wherein the heat sink comprises a base plate, and the conducting arms extend obliquely and upwardly from the base plate.