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Packaged device with acoustic transducer and amplifier

  • US 8,232,615 B2
  • Filed: 02/23/2010
  • Issued: 07/31/2012
  • Est. Priority Date: 02/23/2010
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • an electrically conductive lead frame having an aperture therethrough;

    a semiconductor die mounted on the lead frame, and including at least one acoustic transducer disposed above the aperture and configured to convert between acoustic energy and an electrical signal;

    an acoustic horn integrally connected to the lead frame, the horn extending from the lead frame and comprising a throat positioned adjacent to the acoustic transducer and a mouth opening at an opposite end of the acoustic horn from the throat;

    a substrate mounted on a base portion of the acoustic horn;

    an amplifier mounted on the substrate and being electrically connected to the acoustic transducer; and

    a lid configured together with a base portion of a housing to define a cavity, wherein the acoustic transducer and the amplifier are positioned within the cavity.

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