Semiconductor device

• US 8,232,621 B2
• Filed: 07/24/2007
• Issued: 07/31/2012
• Est. Priority Date: 07/28/2006
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Arai, Yasuyuki
• Primary Examiner(s): Nguyen, Kimberly
• Assistant Examiner(s): Ligai, Maria
• Application Number:
  US11/878,349
• Publication Number:
  US 20080023793A1
• Time in Patent Office: 1,834 Days
• Field of Search: 257/40, 257/E51.005, 257/347, 257/492, 257/E21.022, 257/E27.122, 257/428, 257/531, 257/421, 257/277, 438/622, 438/618
• US Class Current: 257/531
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

When letters are written with a ballpoint pen, pen pressure is greater than or equal to 10 MPa. The IC tag embedded in the paper base material is required to withstand such pen pressure. An integrated circuit including a functional circuit which transmits and receive, performs arithmetic of, and stores information is thinned, and also, when the integrated circuit and a structural body provided with an antenna or a wiring are attached, a second structural body formed of ceramics or the like is also attached to at the same time. When the second structural body formed of ceramics or the like is used, resistance to pressing pressure or bending stress applied externally can be realized. Further, a part of passive elements included in the integrated circuit can be transferred to the second structural body, which leads to reduction in area of the semiconductor device.

Claims

1. A semiconductor device comprising:

a first structural body;

an antenna formed on or in the first structural body, and the antenna is provided with an antenna terminal;

an integrated circuit comprising;

a semiconductor layer interposed between a first insulating layer and a second insulating layer provided over and under the semiconductor layer;

an active element formed with the semiconductor layer; and

a connection electrode formed over the active element; and

a second structural body provided with a passive element and with more stiffness than the first structural body,

wherein the second structural body is provided between the first structural body and the integrated circuit, and

wherein the antenna terminal and the connection electrode are directly in contact with a through electrode formed in the second structural body.

2. The semiconductor device according to claim 1, wherein the first structural body is formed of a plastic sheet, a plastic film, a glass epoxy resin, a glass plate, paper, or a nonwoven fabric.

3. The semiconductor device according to claim 1, wherein the second structural body is formed of a ceramic material.

4. The semiconductor device according to claim 1, wherein the passive element includes a capacitor, a resistor, and a coil.

5. The semiconductor device according to claim 1, wherein the passive element is a capacitor in which a plurality of dielectric layers and electrodes are alternately stacked.

6. A semiconductor device comprising:

a first structural body provided with a first coil, and the first coil is electromagnetically coupled with a reader/writer;

an integrated circuit comprising;

a coil-shaped antenna;

a semiconductor layer interposed between a first insulating layer and a second insulating layer provided over and under the semiconductor layer;

an active element formed with the semiconductor layer;

a wiring formed over the semiconductor layer; and

a third insulating layer formed over the wiring; and

a second structural body provided with a passive element and a second coil, the second coil is electromagnetically coupled with the coil-shaped antenna, and the second coil is electrically connected to the first coil,

wherein the second structural body is provided between the first structural body and the integrated circuit, and

wherein the second structural body has more stiffness than the first structural body.

7. The semiconductor device according to claim 6, wherein the first structural body is formed of a plastic sheet, a plastic film, a glass epoxy resin, a glass plate, paper, or a nonwoven fabric.

8. The semiconductor device according to claim 6, wherein the second structural body is formed of a ceramic material.

9. The semiconductor device according to claim 6, wherein the passive element includes a capacitor, a resistor, and a coil.

10. The semiconductor device according to claim 6, wherein the passive element is a capacitor in which a plurality of dielectric layers and electrodes are alternately stacked.