ESD network circuit with a through wafer via structure and a method of manufacture
First Claim
1. An electrostatic discharge (ESD) structure, comprising:
- an ESD active device; and
at least one through wafer via structure providing a low series resistance path for the ESD active device to a substrate,wherein the at least one through wafer via structure surrounds the ESD active device to form a guard ring to prevent minority carrier migration.
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Accused Products
Abstract
The present invention generally relates to a circuit structure and a method of manufacturing a circuit, and more specifically to an electrostatic discharge (ESD) circuit with a through wafer via structure and a method of manufacture. An ESD structure includes an ESD active device and at least one through wafer via structure providing a low series resistance path for the ESD active device to a substrate. An apparatus includes an input, at least one power rail and an ESD circuit electrically connected between the input and the at least one power rail, wherein the ESD circuit comprises at least one through wafer via structure providing a low series resistance path to a substrate. A method, includes forming an ESD active device on a substrate, forming a ground plane on a backside of the substrate and forming at least one through wafer via electrically connected to a negative power supply of the ESD active device and the ground plane to provide a low series resistance path to the substrate.
41 Citations
22 Claims
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1. An electrostatic discharge (ESD) structure, comprising:
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an ESD active device; and at least one through wafer via structure providing a low series resistance path for the ESD active device to a substrate, wherein the at least one through wafer via structure surrounds the ESD active device to form a guard ring to prevent minority carrier migration. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electrostatic discharge (ESD) structure, comprising:
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an ESD active device; at least one through wafer via structure providing a low series resistance path for the ESD active device to a substrate; at least one inductor, wherein the at least one inductor is electrically connected to the at least one through wafer via; and an inductor shield formed between the at least one inductor and the substrate.
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12. An apparatus, comprising:
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an input; at least one power rail; and an ESD circuit electrically connected between the input and the at least one power rail, wherein the ESD circuit comprises at least one through wafer via structure providing a low series resistance path to a substrate; and at least one of the at least one through wafer via structure and at least one additional through wafer via structure is in contact with a ground plane and provides a guard ring to prevent minority carrier migration. - View Dependent Claims (13)
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14. An apparatus, comprising:
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an input; at least one power rail; an ESD circuit electrically connected between the input and the at least one power rail, wherein the ESD circuit comprises at least one through wafer via structure providing a low series resistance path to a substrate; and the at least one through wafer via structure is in contact with a negative power supply and a ground plane formed on a bottom of the substrate.
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15. An apparatus, comprising:
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an input; at least one power rail; an ESD circuit electrically connected between the input and the at least one power rail, wherein the ESD circuit comprises at least one through wafer via structure providing a low series resistance path to a substrate; and a ground plane formed on a bottom of the substrate electrically connected to the at least one through wafer via structure.
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16. An apparatus, comprising:
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an input; at least one power rail; and an ESD circuit electrically connected between the input and the at least one power rail, wherein the ESD circuit comprises at least one through wafer via structure providing a low series resistance path to a substrate; and at least one inductor, wherein the at least one inductor is electrically connected to the at least one through wafer via. - View Dependent Claims (17)
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18. A method, comprising:
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forming an ESD active device on a substrate; forming a ground plane on a backside of the substrate; and forming at least one through wafer via electrically connected to a negative power supply of the ESD active device and the ground plane to provide a low series resistance path to the substrate, wherein the at least one through wafer via structure is structured and arranged to additionally provide a guard ring to prevent minority carrier migration. - View Dependent Claims (19, 20)
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21. A method, comprising:
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forming an ESD active device on a substrate; forming a ground plane on a backside of the substrate; forming at least one through wafer via electrically connected to a negative power supply of the ESD active device and the ground plane to provide a low series resistance path to the substrate; and forming at least one inductor on the substrate, wherein the at least one inductor is electrically connected to the at least one through wafer via. - View Dependent Claims (22)
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Specification