Enhanced electronic assembly

• US 8,234,034 B2
• Filed: 06/26/2009
• Issued: 07/31/2012
• Est. Priority Date: 06/26/2009
• Status: Active Grant

• Current Assignee: Veoneer, Inc. (SSW Partners LP)
• Original Assignee: Autoliv ASP Incorporated (Autoliv Incorporated)
• Inventors: Brisighella, Dario G. Jr., Bogdan, Stephen, Leach, William M., Kida, Jeffrey T., Rakes, Richard Jr.
• Primary Examiner(s): ARTHUR JEANGLAUDE, GERTRUDE
• Application Number:
  US12/492,463
• Publication Number:
  US 20100332074A1
• Time in Patent Office: 1,131 Days
• Field of Search: 701/29.4, 701/29.7, 701/34.4, 701/36, 701/53, 701/412, 701/29.1, 701/31.4, 280/734, 280/735, 280/736
• US Class Current: 701/29.1
• CPC Class Codes: H05K 5/06 Hermetically-sealed casings specially adapted for small components H05K5/0095

Abstract

Remote sensor units for a vehicle are described. A remote sensor unit may comprise an electronic assembly. The electronic assembly may comprise an electronic component. The electronic assembly may comprise one or more signal terminals coupled to the electronic component. The electronic assembly may comprise a protective enclosure arranged to encapsulate the electronic component. The protective enclosure is arranged to isolate the electronic component from thermal energy, pressure or residual material stress associated with one or more satellite housings. Other embodiments are described and claimed.

Claims

1. An electronic assembly, comprising:

an electronic component comprising an electronic sensor arranged to monitor conditions for a vehicle;

one or more signal terminals coupled to the electronic sensor;

a protective enclosure arranged to encapsulate at least the electronic component to isolate the electronic component from thermal energy, pressure or residual material stress; and

a satellite housing arranged to encapsulate the protective enclosure, the satellite housing adapted to mount to the vehicle.

2. The electronic assembly of claim 1, the electronic component comprising a substrate having the electronic sensor mounted on one or both sides of the substrate.

3. The electronic assembly of claim 1, the electronic component comprising a double-sided substrate having a first electrical connector disposed on a first side of the substrate and a second electrical connector disposed on a second side of the substrate, the first and second electrical connectors connected to respective first and second signal terminals.

4. The electronic assembly of claim 1, the electronic sensor comprising an integrated circuit, and the electronic component comprising a printed circuit board having the integrated circuit mounted on one side of the printed circuit board.

5. The electronic assembly of claim 1, the electronic sensor comprising an accelerometer, a decelerometer, an impact sensor, pressure sensor, a wheel speed sensor, a brake pressure sensor, a seat occupancy sensor, a crush zone sensor, a temperature sensor or a gyroscope.

6. The electronic assembly of claim 1, the protective enclosure comprising a single portion formed into a single hermetically sealed structure.

7. The electronic assembly of claim 1, the protective enclosure comprising multiple portions arranged for assembly into a single hermetically sealed structure.

8. The electronic assembly of claim 1, the protective enclosure comprising a lid portion and a base portion, the lid portion to house the electronic sensor and a portion of the signal terminals, the base portion having one or more apertures corresponding to the one or more signal terminals to receive the signal terminals and mate with the lid portion to form a hermetically sealed structure.

9. The electronic assembly of claim 1, the protective enclosure comprising a metal, a metallic alloy, a ceramic or a synthetic polymer.

10. The electronic assembly of claim 1, the protective enclosure arranged to isolate the electronic component from thermal energy, pressure or residual material stress associated with a material or manufacturing technique used to form one or more satellite housings.

11. The electronic assembly of claim 1, the protective enclosure arranged to encapsulate the electronic component including the electronic sensor and a portion of the signal terminals.

12. The electronic assembly of claim 1, the protective enclosure arranged to encapsulate the electronic component including the electronic sensor and the signal terminals.

13. The electronic assembly of claim 1, the electronic sensor arranged to monitor conditions for a vehicle and output data signals to a vehicle monitoring system.

14. The electronic assembly of claim 1, the satellite housing comprising a single portion formed into a single hermetically sealed structure.

15. The electronic assembly of claim 1, the satellite housing comprising multiple portions arranged for assembly into a single hermetically sealed structure.

16. The electronic assembly of claim 1, the satellite housing comprising an overmold created using an overmold material comprising a thermoplastic or thermosetting plastic.

17. The electronic assembly of claim 1, the satellite housing formed as a vehicle part.

18. The electronic assembly of claim 1, the satellite housing formed in a shape of a standard fastener.

19. The electronic assembly of claim 1, the satellite housing comprising a standard fastener having an aperture aligned with an axis for the signal terminals for automatically orienting the signal terminals for electrical interconnection with a communications medium.