Substrate inductive devices and methods
First Claim
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1. A method of manufacturing an inductive device, said method comprising:
- providing at least three substrates comprising a top substrate, a bottom substrate and one or more middle substrates, at least one of said at least three substrates comprised of an exterior surface which is at least partly copper plated, with said at least one substrate having one or more windings formed thereon;
disposing a plurality of conductors in the at least one of said three substrates, said conductors disposed so as to extend from said exterior copper plated surface and substantially through at least one or more said substrates;
disposing a magnetically permeable core at least partly between two or more of said at least three substrates;
disposing a second magnetically permeable core at least partly between two or more of said at least three substrates; and
disposing an incorporated electronic component onto at least one of said at least three substrates;
wherein said second magnetically permeable core in combination with said at least three substrates, said conductors, said incorporated electronic component, and said magnetically permeable core, form a complete filter circuit.
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Abstract
Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
51 Citations
22 Claims
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1. A method of manufacturing an inductive device, said method comprising:
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providing at least three substrates comprising a top substrate, a bottom substrate and one or more middle substrates, at least one of said at least three substrates comprised of an exterior surface which is at least partly copper plated, with said at least one substrate having one or more windings formed thereon; disposing a plurality of conductors in the at least one of said three substrates, said conductors disposed so as to extend from said exterior copper plated surface and substantially through at least one or more said substrates; disposing a magnetically permeable core at least partly between two or more of said at least three substrates; disposing a second magnetically permeable core at least partly between two or more of said at least three substrates; and disposing an incorporated electronic component onto at least one of said at least three substrates; wherein said second magnetically permeable core in combination with said at least three substrates, said conductors, said incorporated electronic component, and said magnetically permeable core, form a complete filter circuit. - View Dependent Claims (2, 3)
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4. A method of manufacturing an inductive device, said method comprising:
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providing a pair of substrates, each comprised of an exterior surface which is at least partly plated, with copper or a copper alloy, each of said substrates having one or more windings formed thereon; incorporating an electronic component onto at least one of said pair of substrates; disposing a plurality of conductors, at least a portion of said plurality of conductors extending from said exterior plated surface and substantially through said substrate; disposing one or more magnetically permeable core(s) at least partly between said pair of substrates; and disposing a second magnetically permeable core, said second magnetically permeable core in combination with said substrates, said conductors, said incorporated electronic component, and other ones of said one or more magnetically permeable core(s), forming a complete filter circuit; wherein said pair of substrates are spaced apart a first distance, said one or more windings in combination with said one or more magnetically permeable core(s) and said conductors forming said inductive device. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of manufacturing a partially wired inductive device, said method comprising:
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providing a plurality of substrates, each of said substrates having one or more conductive pathways disposed thereon; molding a bundle of magnet wires to form a wired core center; disposing said molded bundle of magnet wires at least partly between said plurality of printable substrates; and disposing a magnetically permeable core at least partly between said plurality of printable substrates. - View Dependent Claims (14, 15, 16)
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17. A method of manufacturing an integrated inductive device electronics assembly, said method comprising:
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obtaining a plurality of substrates, at least two of said substrates each comprised of an exterior surface which is at least partly plated with copper or a copper alloy, said at least two substrates having one or more windings formed thereon; wherein an electronic component receiving pad is disposed on at least one of said plurality of substrates; disposing an electronic component onto said electronic component receiving pad; disposing a plurality of conductors, at least a portion of said plurality of conductors formed to extend from said exterior plated surface and substantially through said respective substrate; and disposing a plurality of magnetically permeable cores at least partly between said at least two substrates; wherein said at least two substrates are spaced apart a first distance, with said one or more windings, said plurality of magnetically permeable cores, said electronic component, and said conductors collectively comprising said integrated inductive device electronics assembly. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification