Manufacturing method of semiconductor device
First Claim
1. A manufacturing method of a semiconductor device comprising the steps of:
- forming a gate electrode layer over a substrate having an insulating surface;
forming a gate insulating layer over the gate electrode layer;
forming an oxide semiconductor layer over the gate insulating layer;
performing a first heat treatment on the oxide semiconductor layer after forming the oxide semiconductor layer;
forming a source electrode layer and a drain electrode layer over the oxide semiconductor layer;
forming a protective insulating layer on the oxide semiconductor layer; and
performing a second heat treatment in which increase and decrease in temperature are repeated plural times on the oxide semiconductor layer, after forming the protective insulating layer,wherein a temperature of the second heat treatment is lower than a temperature of the first heat treatment.
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Abstract
It is an object to provide a manufacturing method of a structure of a thin film transistor including an oxide semiconductor film, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible. A protective insulating layer is formed to cover a thin film transistor including an oxide semiconductor layer that is dehydrated or dehydrogenated by first heat treatment, and second heat treatment at a temperature that is lower than that of the first heat treatment, in which the increase and decrease in temperature are repeated plural times, is performed, whereby a thin film transistor including an oxide semiconductor layer, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible without depending on the channel length, can be manufactured.
157 Citations
16 Claims
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1. A manufacturing method of a semiconductor device comprising the steps of:
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forming a gate electrode layer over a substrate having an insulating surface; forming a gate insulating layer over the gate electrode layer; forming an oxide semiconductor layer over the gate insulating layer; performing a first heat treatment on the oxide semiconductor layer after forming the oxide semiconductor layer; forming a source electrode layer and a drain electrode layer over the oxide semiconductor layer; forming a protective insulating layer on the oxide semiconductor layer; and performing a second heat treatment in which increase and decrease in temperature are repeated plural times on the oxide semiconductor layer, after forming the protective insulating layer, wherein a temperature of the second heat treatment is lower than a temperature of the first heat treatment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A manufacturing method of a semiconductor device comprising the steps of:
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forming a gate electrode layer over a substrate having an insulating surface; forming a gate insulating layer over the gate electrode layer; forming an oxide semiconductor layer over the gate insulating layer; performing a first heat treatment on the oxide semiconductor layer after forming the oxide semiconductor layer; forming a source electrode layer and a drain electrode layer over the oxide semiconductor layer; forming a protective insulating layer on the oxide semiconductor layer; and performing a second heat treatment on the oxide semiconductor layer, after forming the protective insulating layer, wherein a treatment time of the second heat treatment is longer than a treatment time of the first heat treatment, and wherein a temperature of the second heat treatment is lower than a temperature of the first heat treatment. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification