Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same

• US 8,237,173 B2
• Filed: 12/16/2009
• Issued: 08/07/2012
• Est. Priority Date: 07/16/2003
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Nagai, Hideo
• Primary Examiner(s): Pham, Long
• Application Number:
  US12/639,375
• Publication Number:
  US 20100117056A1
• Time in Patent Office: 965 Days
• Field of Search: 257/79, 257/84, 257/184
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate

Abstract

The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device according to the present invention includes a luminous layer, a light transmission layer disposed over a main surface of the luminous layer, and having depressions on a surface facing away from the luminous layer, and a transmission membrane disposed on the light transmission layer so as to follow contours of the depressions, and light from the luminous layer is irradiated so as to pass through the light transmission layer and the transmission membrane.

Claims

1. A semiconductor light emitting device having a luminous layer sandwiched between a plurality of layers, comprising:

a light transmission layer that is one layer of the plurality of layers, disposed on a light emitting side of the luminous layer, and having depressions on a surface facing away from the luminous layer, wherein the light transmission layer is an n-GaN layer doped with Si; and

a transmission membrane that is one layer of the plurality of layers, disposed on the light transmission layer so as to follow contours of the depressions,

a thin metallic film that is one layer of the plurality of layers, disposed on a side facing away from the light emitting side of the luminous layer, wherein

the depressions of the light transmission layer exist in an interface portion that interfaces with the transmission membrane.

2. A semiconductor light emitting device according to claim 1, wherein the light transmission layer is in direct contact with a main surface of the light emitting side of the luminous layer.

3. A semiconductor light emitting device according to claim 1, wherein the depressions are formed irregularly.

4. A semiconductor light emitting device according to claim 1, wherein the transmission membrane is formed with no space between the transmission membrane and the surface of the light transmission layer on which depressions are provided.

5. A semiconductor light emitting device according to claim 1, wherein the thin metallic film is a p-electrode or n-electrode.

6. A semiconductor light emitting device according to claim 1, wherein a surface of the transmission membrane facing away from the light transmission layer is substantially flat.

7. A semiconductor light emitting device according to claim 1, wherein the transmission membrane contains a luminous substance that is excitable by the light from the luminous layer.

8. A semiconductor light emitting device according to claim 7, wherein the luminous substance in the transmission membrane exists only on the light transmitting layer.

9. A semiconductor light emitting device according to claim 7, wherein the light from the luminous layer is converted into white light by passing through the transmission membrane.

10. A semiconductor light emitting device according to claim 7, wherein when the light emitted from the luminous layer passes through the transmission membrane, one portion is converted by the luminous material, and the remaining portion is not converted, and white light is formed by compositing together the light that has been converted and the light that has not been converted.

11. A semiconductor light emitting device according to claim 1, wherein the luminous layer is composed of a quantum well structure of InGaN/GaN.

12. A semiconductor light emitting device according to claim 1, wherein the transmission membrane is composed of one of polyimide resin, epoxy resin, silicone resin, sol-gel glass, and low melting point glass.

13. A semiconductor light emitting device according to claim 1, further comprising a substrate that forms a base, wherein the substrate is composed of one of GaN, SiC, sapphire, AlN, and Si.

14. A semiconductor light emitting device according to claim 1, further comprising a ceramic substrate that forms a base, wherein the ceramic substrate is composed of one of AIN, Al₂0₃, BN, MgO, ZnO, and SiC.

15. A semiconductor light emitting device according to claim 1, wherein the luminous layer is provided on a light transmission substrate,

the light transmission layer is partially or entirely formed on the light transmission substrate, and

the depressions are provided on a main surface on a side facing away from a side of the light transmission substrate on which the luminous layer is provided.

16. A semiconductor light emitting device according to claim 15, wherein the light transmission layer has a substantially identical refractive index as the luminous layer and the plurality of layers.

17. A semiconductor light emitting device according to claim 15, wherein the light transmission substrate is composed of one of GaN, SiC, and MN.

18. A semiconductor light emitting device according to claim 1, wherein the luminous layer is provided on a substrate, and

the light transmission layer is provided on a main surface of the luminous layer facing away from the substrate, wherein a DBR layer is inserted between the luminous layer and the substrate.

19. A semiconductor light emitting device having a luminous layer sandwiched between a plurality of layers, comprising:

a light transmission layer that is one layer of the plurality of layers, disposed on a light emitting side of the luminous layer, and having depressions on a surface facing away from the luminous layer; and

a transmission membrane that is one layer of the plurality of layers, disposed on the light transmission layer so as to follow contours of the depressions,

a thin metallic film that is one layer of the plurality of layers, disposed on a side facing away from the light emitting side of the luminous layer, wherein

the depressions of the light transmission layer exist in an interface portion that interfaces with the transmission membrane, wherein the luminous layer is provided on a light transmission substrate,

the light transmission layer is partially or entirely formed on the light transmission substrate, and

the depressions are provided on a main surface on a side facing away from a side of the light transmission substrate on which the luminous layer is provided.

20. A semiconductor light emitting device having a luminous layer sandwiched between a plurality of layers, comprising:

a light transmission layer that is one layer of the plurality of layers, disposed on a light emitting side of the luminous layer, and having depressions on a surface facing away from the luminous layer;

a transmission membrane that is one layer of the plurality of layers, disposed on the light transmission layer so as to follow contours of the depressions,

a thin metallic film that is one layer of the plurality of layers, disposed on a side facing away from the light emitting side of the luminous layer, wherein

the depressions of the light transmission layer exist in an interface portion that interfaces with the transmission membrane layer is provided on a substrate, and

the light transmission layer is provided on a main surface of the luminous layer facing away from the substrate, and a DBR layer is inserted between the luminous layer and the substrate.