Semiconductor member, semiconductor article manufacturing method, and LED array using the manufacturing method
First Claim
1. A method of manufacturing a semiconductor article having a compound semiconductor multilayer film formed on a semiconductor substrate, comprising the steps of:
- preparing a first structure comprising a first semiconductor substrate, a compound semiconductor multilayer film, and an etching sacrificial layer provided between the first semiconductor substrate and the compound semiconductor multilayer film, wherein a first groove is formed in the compound semiconductor multilayer film so as to expose the etching sacrificial layer, and wherein the first semiconductor substrate is a compound semiconductor substrate;
preparing a second structure comprising a second semiconductor substrate and an insulating layer, wherein a second groove is formed so as to pass through the second semiconductor substrate;
bonding the first and second structures so as to form a bonded member in which the first and second grooves are connected to each other; and
bringing an etchant into contact with the etching sacrificial layer through the connected first and second grooves and thus etching the etching sacrificial layer to separate the first semiconductor substrate from the bonded member.
1 Assignment
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Accused Products
Abstract
A novel semiconductor article manufacturing method and the like are provided. A method of manufacturing a semiconductor article having a compound semiconductor multilayer film formed on a semiconductor substrate includes: preparing a member including an etching sacrificial layer (1010), a compound semiconductor multilayer film (1020), an insulating film (2010), and a semiconductor substrate (2000) on a compound semiconductor substrate (1000), and having a first groove (2005) which passes through the semiconductor substrate and the insulating film, and a semiconductor substrate groove (1025) which is a second groove provided in the compound semiconductor multilayer film so as to be connected to the first groove, and bringing an etchant into contact with the etching sacrificial layer through the first groove and then the second groove and etching the etching sacrificial layer to separate the compound semiconductor substrate from the member.
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Citations
16 Claims
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1. A method of manufacturing a semiconductor article having a compound semiconductor multilayer film formed on a semiconductor substrate, comprising the steps of:
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preparing a first structure comprising a first semiconductor substrate, a compound semiconductor multilayer film, and an etching sacrificial layer provided between the first semiconductor substrate and the compound semiconductor multilayer film, wherein a first groove is formed in the compound semiconductor multilayer film so as to expose the etching sacrificial layer, and wherein the first semiconductor substrate is a compound semiconductor substrate; preparing a second structure comprising a second semiconductor substrate and an insulating layer, wherein a second groove is formed so as to pass through the second semiconductor substrate; bonding the first and second structures so as to form a bonded member in which the first and second grooves are connected to each other; and bringing an etchant into contact with the etching sacrificial layer through the connected first and second grooves and thus etching the etching sacrificial layer to separate the first semiconductor substrate from the bonded member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing a light-emitting device comprising the steps of:
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forming a separation layer and a light-emitting layer on a first substrate in the stated order from the side of the first substrate; bonding the first substrate to a second substrate such that the light-emitting layer is positioned inside to form a bonded member; and transferring the light-emitting layer onto the second substrate by etching and removing the separation layer, wherein a pair of the separation layer and the light-emitting layer on the first substrate is repeatedly deposited n times, the n being a natural number of two or more, only the uppermost light-emitting layer is patterned into a shape of a plurality of islands, and then the first substrate is bonded to the second substrate to form the bonded member, and wherein an etchant is caused to penetrate into a space which is formed in the bonded member by the island-shape patterning, thereby bringing the separation layer into contact with the etchant to selectively transfer the island-shaped light-emitting layer onto the second substrate.
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Specification