In-molded capacitive sensors
First Claim
1. A plastic embedded capacitive sensor comprising:
- a plastic film comprising a first side and a second side;
an injection molded plastic layer; and
a capacitive sensor pattern embedded between said second side and said injection molded plastic layer such that access to a region of said capacitive sensor pattern is maintained for facilitating electrical contact with said capacitive sensor pattern.
3 Assignments
0 Petitions
Accused Products
Abstract
In a method for forming an in-molded capacitive sensing device a plastic film is provided, the plastic film comprising a first side and a second side. A capacitive sensor pattern is disposed on at least a portion of the second side, the capacitive sensor pattern including a region for facilitating electrical contact. A resin layer is printed over a portion of the capacitive sensor pattern such that access to the region for facilitating electrical contact is maintained. A plastic layer is injection molded onto a portion of the resin layer such that the capacitive sensor pattern becomes in-molded between the plastic film and the plastic layer while access to the region for facilitating electrical contact is maintained.
11 Citations
10 Claims
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1. A plastic embedded capacitive sensor comprising:
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a plastic film comprising a first side and a second side; an injection molded plastic layer; and a capacitive sensor pattern embedded between said second side and said injection molded plastic layer such that access to a region of said capacitive sensor pattern is maintained for facilitating electrical contact with said capacitive sensor pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification