Printed wiring board and method for manufacturing same

• US 8,238,114 B2
• Filed: 08/08/2008
• Issued: 08/07/2012
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Niki, Ayao, Kitajima, Kazuhisa
• Primary Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US12/188,795
• Publication Number:
  US 20090078451A1
• Time in Patent Office: 1,460 Days
• Field of Search: 174/260, 174/261, 174/262, 174/263, 361/760, 361/768, 361/783, 361748-751, 361/790, 361/792, 361/794, 361/808, 361/767, 361/728, 361/735
• US Class Current: 361/767
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/1536 Temporarily stacked PCBs
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49167 with deforming of conductive path

Abstract

A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

Claims

1. A printed wiring board comprising:

a plurality of conductive layers having a plurality of conductive circuits;

a plurality of resin insulation layers having a plurality of openings and including an uppermost resin insulation layer positioned as an outermost layer of the plurality of resin insulation layers, the uppermost resin insulation layer being formed on a second uppermost resin insulation layer;

a plurality of via conductors formed in the plurality of openings, respectively, and connecting the plurality of conductive circuits in the plurality of conductive layers; and

a plurality of component-loading pads comprising a copper foil and positioned to load an electronic component,

wherein the resin insulation layers and the conductive layers are alternately laminated, the component-loading pads are formed on the uppermost resin insulation layer, the component-loading pads are truncated such that an area of a bottom surface touching a surface of the uppermost resin insulation layer is made larger than an area of a top surface on which to load the electronic component, the component-loading pads have side surfaces slanting from the top surface to the bottom surface, the top surface is substantially flat, the via conductors formed in the uppermost resin insulation layer each have a first surface in contact with one of the component-loading pads and a second surface which is opposite to the first surface and in contact with one of the via conductors formed in the second uppermost resin insulation layer, the via conductors formed in the uppermost resin insulation layer are truncated such that the first surface has a smaller area than the second surface, and the second surface has a dented portion to which the via conductor formed in the second uppermost resin insulation layer is connected.

2. The printed wiring board according to claim 1, further comprising a plurality of solder members formed on top surfaces of the component-loading pads on which the electronic component is mounted and on side surfaces of the component-loading pads, respectively.

3. The printed wiring board according to claim 2, wherein the side surfaces of the component-loading pads are roughened.

4. The printed wiring board according to claim 1, wherein the uppermost resin insulation layer does not have a conductive circuit drawn from the component-loading pads toward a periphery of the plurality of resin insulation layers.

5. The printed wiring board according to claim 1, wherein the uppermost resin insulation layer has a pad-forming region in which the component-loading pads are positioned, and the uppermost resin insulation layer has a surface which is exposed and is in a region excluding the pad-forming region.

6. The printed wiring board according to claim 1, further comprising a plurality of protective films formed on top surfaces and side surfaces of the component-loading pads, respectively.

7. The printed wiring board according to claim 1, wherein the plurality of interlayer resin insulation layers includes at least one insulation layer containing a filling material and the filling material does not contain glass cloth and long glass fiber.

8. The printed wiring board according to claim 1, further comprising at least one of an inner conductive circuit for power supply and an inner conductive circuit for ground, wherein the plurality of component-loading pads includes a plurality of power-supply component-loading pads and a plurality of ground component-loading pads, the plurality of component-loading pads is formed in a region in which at least one of the inner conductive circuit for power supply and the inner conductive circuit for ground is formed, the inner conductive circuit for power supply is electrically connected to the power-supply component-loading pads, and the inner conductive circuit for ground is electrically connect to the ground component-loading pads.