System and method for wireless and dynamic intra-process measurement of integrated circuit parameters

• US 8,239,811 B2
• Filed: 03/24/2008
• Issued: 08/07/2012
• Est. Priority Date: 03/24/2008
• Status: Active Grant

• Current Assignee: Marvell Asia Pte Limited (Marvell Technology Group Limited)
• Original Assignee: International Business Machines Corporation
• Inventors: Anemikos, Theodoros E., Corson, Phillip L., Erturk, Mete, Hall, Ezra D. B., Perri, Anthony J., Ventrone, Sebastian T.
• Primary Examiner(s): Siek, Vuthe
• Assistant Examiner(s): Alam, Mohammed
• Application Number:
  US12/053,705
• Publication Number:
  US 20090240452A1
• Time in Patent Office: 1,597 Days
• Field of Search: 716/136, 716/134
• US Class Current: 716/134
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32
• CPC Class Codes: H01L 23/64 Impedance arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04Q 9/00 Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Abstract

Disclosed are embodiments of a system and a method that allow for wireless and dynamic intra-process (i.e., during and/or between process steps) measurements of integrated circuit parameters. The embodiments incorporate the use of a passive circuit, such as an inductor-capacitor-resistor (LCR) circuit resonator, that has a predetermined sensitivity to process variations in one or more physical or electrical integrated circuit parameters. The passive circuit can be wirelessly interrogated between and/or process steps. Then, the actual behavior exhibited by the passive circuit in response to the interrogation is compared to the expected behavior of an optimal circuit in the absence of process variations in order to determine the one or more parameters. Also disclosed is an embodiment of an exemplary passive circuit that can be used to implement the disclosed system and method embodiments.

Claims

1. A system for wireless measurement of integrated circuit parameters, said system comprising:

a wafer comprising a passive circuit with a predetermined sensitivity to process variations in at least one integrated circuit parameter, said at least one integrated circuit parameter comprises at least one of a physical parameter and an electrical parameter;

an interrogation unit positioned adjacent to, without contacting, said passive circuit, said interrogation unit wirelessly applying a stimulus to said passive circuit and further wirelessly detecting actual circuit behavior of a specific type exhibited by said passive circuit in response to said stimulus; and

an analyzer in communication with said interrogation unit and determining a value for said at least one integrated circuit parameter based on a difference between expected circuit behavior to be exhibited by said passive circuit in response to said stimulus and said actual circuit behavior exhibited by said passive circuit in response to said stimulus.

2. The system according to claim 1, further comprising a stimulus source connected to said interrogation unit and generating said stimulus for application to said passive circuit through said interrogation unit.

3. The system according to claim 1, further comprising a sensor in communication with said interrogation unit and said analyzer, said sensor sensing said actual circuit behavior as detected by said interrogation unit, measuring said actual circuit behavior and transmitting a measurement of said actual circuit behavior to said analyzer.

4. The system according to claim 1, said analyzer further determining values for multiple integrated circuit parameters based on said actual circuit behavior.

5. The system according to claim 1, said passive circuit and said interrogation unit being separated by a space comprises one of air and a dielectric material.

6. The system according to claim 1,

said wafer further comprising an additional passive circuit with a different predetermined sensitivity to said process variations in said at least one integrated circuit parameter as compared to said predetermined sensitivity of said passive circuit, and

said system further comprising an additional interrogation unit positioned adjacent to, without contacting, said additional passive circuit, said additional interrogation unit wirelessly applying an additional stimulus to said additional passive circuit and further wirelessly detecting additional actual circuit behavior of said specific type exhibited by said additional passive circuit in response to said additional stimulus,

said analyzer further determining said value for said at least one integrated circuit parameter based also on a difference between additional expected circuit behavior to be exhibited by said additional passive circuit in response to said stimulus and said additional actual circuit behavior exhibited by said additional passive circuit in response to said stimulus.

7. The system according to claim 1,

said wafer further comprising an additional passive circuit with said predetermined sensitivity to said process variations in said at least one integrated circuit parameter, said interrogation unit further being positioned adjacent to, without contacting, said additional passive circuit, said interrogation unit wirelessly applying said stimulus to said additional passive circuit and further wirelessly detecting additional actual circuit behavior of said specific type exhibited by said additional passive circuit in response to said stimulus,

said additional passive circuit being tuned differently than said passive circuit so that said interrogation unit can simultaneously interrogate said passive circuit and said additional passive circuit and so that said analyzer can further determine said value for said at least one integrated circuit parameter based on a difference between additional expected circuit behavior to be exhibited by said additional passive circuit in response to said stimulus and said additional actual circuit behavior exhibited by said additional passive circuit in response to said stimulus.

8. A passive resonator with a predetermined sensitivity to process variations in at least one integrated circuit parameter, said passive resonator comprising:

a substrate;

at least one structure with resistive behavior on said substrate;

at least one structure with inductive behavior on said substrate; and

at least one structure with capacitive behavior on said substrate, said at least one structure with resistive behavior, said at least one structure with capacitive behavior and said at least one structure with inductive behavior being interconnected and configured to form an inductor-capacitor-resistor (LCR) circuit that exhibits, in response to radio frequency energy, resonant behavior that varies in a predictable manner as a function of said process variations in said at least one integrated circuit parameter, said at least one integrated circuit parameter comprising one of a physical parameter and an electrical parameter.

9. The passive circuit according to claim 8, said inductor-capacitor-resistor (LCR) circuit comprises a three-layer structure comprising:

a metal inductor layer comprising said at least one structure with inductive behavior;

a polysilicon resistor layer aligned below said metal inductor layer and comprising said at least one structure with resistive behavior; and

a dielectric layer between said polysilicon resistor layer and said metal inductor layer such that said polysilicon resistor layer, said dielectric layer and said metal inductor layer, in combination, form said at least one structure with capacitive behavior,

said resonant behavior varying in said predictable manner, due to the physical dimensions and shapes of said metal inductor layer, said dielectric layer and said polysilicon layer.

10. The passive circuit according to claim 9, further comprising a contact extending vertically through said dielectric layer and electrically connecting said polysilicon resistor layer and said metal inductor layer.

11. The passive circuit according to claim 9, said polysilicon resistor layer comprising a first section aligned below a center of said metal inductor layer and a plurality of second sections extending radially from said first section beyond an outer edge of said metal inductor layer.

12. The passive circuit according to claim 9, said metal inductor layer comprising a spiral-shaped metal wire with an inner end electrically connected to said polysilicon resistor layer.

13. The passive circuit according to claim 9, said at least one integrated circuit parameter comprises at least one of polysilicon sheet resistance, contact height and metal sheet resistance.

14. A system for wireless measurement of integrated circuit component parameters, said system comprising:

a wafer comprising a passive resonator with a predetermined sensitivity to process variations in at least one integrated circuit parameter, said at least one integrated circuit parameter comprising at least one of a physical parameter and an electrical parameter;

an interrogation unit positioned adjacent to, without contacting, said passive resonator, said interrogation unit wirelessly applying a stimulus to said passive resonator, said stimulus comprising a radio frequency energy and said interrogation unit further wirelessly detecting actual resonant behavior exhibited by said passive resonator in response to said radio frequency energy; and

an analyzer in communication with said interrogation unit and determining a value for said at least one integrated circuit parameter based on a difference between expected resonant behavior to be exhibited by said passive resonator in response to said radio frequency energy and said actual resonant behavior exhibited by said passive resonator in response to said radio frequency energy.

15. The system according to claim 14, said interrogation unit comprising a wire coil inductively coupled to said passive resonator, said wire coil having an input node receiving said radio frequency energy at one end for application to said passive resonator and further having an output node at an opposite end.

16. The system according to claim 15, said radio frequency energy comprising a radio frequency pulse and said system further comprising:

a pulse generator generating and applying said radio frequency pulse to said input node; and

a spectrum analyzer electrically connected between said output node and said analyzer, said spectrum analyzer sensing, at said output node, said actual resonant behavior as detected by said interrogation unit, measuring said actual resonant behavior in order to generate a frequency spectrum based on said actual resonant behavior, and transmitting said frequency spectrum to said analyzer.

17. The system according to claim 15, said radio frequency energy comprising a sine voltage and said system further comprising:

a sine sweep generator generating and applying said sine voltage to said input node; and

a spectrum analyzer electrically connected between said output node and said analyzer, said spectrum analyzer sensing, at said output node, said actual resonant behavior as detected by said interrogation unit, measuring said actual resonant behavior in order to generate a phase spectrum and an amplitude spectrum based on said actual resonant behavior, and transmitting said phase spectrum and said amplitude spectrum to said analyzer.

18. A method for wireless measurement of integrated circuit parameters, said method comprising:

providing a wafer comprising a passive circuit having a predetermined sensitivity to process variations in at least one integrated circuit parameter, said at least one integrated circuit comprising at least one of a physical parameter and an electrical parameter;

wirelessly interrogating said passive circuit using an interrogation unit positioned adjacent to, without contacting, said passive circuit, said wirelessly interrogating comprising;

wirelessly applying a stimulus to said passive circuit; and

wirelessly detecting actual circuit behavior of a specific type exhibited by said passive circuit in response to said stimulus; and

determining, by an analyzer in communication with said interrogation unit, a value for said at least one integrated circuit parameter based on a difference between expected circuit behavior to be exhibited by said passive circuit in response to said stimulus and said actual circuit behavior exhibited by said passive circuit in response to said stimulus.

19. The method according to claim 18, further comprising, before said providing of said wafer, designing said passive circuit and simulating behavior of said passive circuit in the absence of process variations and in the presence of different processes variations.

20. The method according to claim 18, further comprising, before said determining, normalizing said actual circuit behavior to account for at least one of scaling, offset and noise errors.