Selective deposition of metal-containing cap layers for semiconductor devices
First Claim
1. A method of forming a semiconductor device, comprising:
- providing a patterned substrate containing metal surfaces and dielectric layer surfaces;
modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, the modifying substituting a hydrophilic functional group in the dielectric layer surfaces with the hydrophobic functional group; and
depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor, wherein the depositing comprises;
exposing the modified dielectric layer surfaces and the metal surfaces to the metal-containing precursor vapor to deposit metal layers selectively on the metal surfaces, wherein the metal-containing precursor vapor contains a metal element selected from platinum (Pt), gold (Au), ruthenium (Ru), cobalt (Co), tungsten (W), rhodium (Rh), iridium (Ir), or palladium (Pd), or a combination of two or more thereof, andincorporating a dopant into the metal layers by exposing the deposited metal layers to a dopant gas selected from PH3, BH3, B2H6, BF3, NF3, NH3, N2, N2H4, PF3, PBr3, BCl3, Bl3, SiH4, Si2H6, SiH3Cl, SiH2Cl2, SiHCl3, SiCl4, Si2Cl6, SiH3F, SiH2F, SiHF3, SiF4, Si2F6, GeH4, or GeCl4, or a combination of two or more thereof, wherein the incorporating comprises exposing the metal layers to a gas cluster ion beam (GCIB) or an ion implant beam containing the dopant gas.
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Abstract
A method for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes providing a patterned substrate containing metal surfaces and dielectric layer surfaces, and modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, where the modifying substitutes a hydrophilic functional group in the dielectric layer surfaces with a hydrophobic functional group. The method further includes depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor.
39 Citations
9 Claims
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1. A method of forming a semiconductor device, comprising:
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providing a patterned substrate containing metal surfaces and dielectric layer surfaces; modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, the modifying substituting a hydrophilic functional group in the dielectric layer surfaces with the hydrophobic functional group; and depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor, wherein the depositing comprises; exposing the modified dielectric layer surfaces and the metal surfaces to the metal-containing precursor vapor to deposit metal layers selectively on the metal surfaces, wherein the metal-containing precursor vapor contains a metal element selected from platinum (Pt), gold (Au), ruthenium (Ru), cobalt (Co), tungsten (W), rhodium (Rh), iridium (Ir), or palladium (Pd), or a combination of two or more thereof, and incorporating a dopant into the metal layers by exposing the deposited metal layers to a dopant gas selected from PH3, BH3, B2H6, BF3, NF3, NH3, N2, N2H4, PF3, PBr3, BCl3, Bl3, SiH4, Si2H6, SiH3Cl, SiH2Cl2, SiHCl3, SiCl4, Si2Cl6, SiH3F, SiH2F, SiHF3, SiF4, Si2F6, GeH4, or GeCl4, or a combination of two or more thereof, wherein the incorporating comprises exposing the metal layers to a gas cluster ion beam (GCIB) or an ion implant beam containing the dopant gas. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a semiconductor device, comprising:
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providing a patterned substrate containing metal surfaces and dielectric layer surfaces; modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, the modifying substituting a hydrophilic functional group in the dielectric layer surfaces with the hydrophobic functional group; and depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor and a non-metal dopant gas, wherein the modified dielectric layer surfaces and the metal surfaces are contemporaneously exposed to the metal-containing precursor vapor and the non-metal dopant gas, and wherein the metal-containing precursor vapor contains a metal element selected from platinum (Pt), gold (Au), ruthenium (Ru), cobalt (Co), tungsten (W), rhodium (Rh), iridium (Ir), or palladium (Pd), or a combination of two or more thereof, and the dopant gas is selected from PH3, BH3, B2H6, BF3, NF3, NH3, N2, N2H4, PF3, PBr3, BCl3, Bl3, SiH4, Si2H6, SiH3Cl, SiH2Cl2, SiHCl3, SiCl4, Si2Cl6, SiH3F, SiH2F, SiHF3, SiF4, Si2F6, GeH4, or GeCl4, or a combination of two or more thereof. - View Dependent Claims (9)
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Specification