Method and device for holding together an electronically non-conductive stack of objects
First Claim
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1. Method of holding together electrically non-conductive objects, comprising:
- forming a stack of the electrically non-conductive objects; and
applying to a side of the stack a static polarity with a planar electrode to electrostatically holding the objects together;
wherein the planar electrode comprisesa conductive layer, anda layer of semi-conductive material that covers the conductive layer and defines an outermost surface of the planar electrode; and
wherein said applying comprises;
connecting the conductive layer to a static electricity source, anddirectly contacting the semi-conductive material with said side of the stack to apply static electricity from the static electricity source, via the conductive layer to the semi-conductive material, and then to said side of the stack;
whereinthe semi-conductive material is elastically deformable,the semi-conductive material deforms upon direct contact with said side of the stack to ensure close contact and homogeneous transfer of the static electricity to the electrically non-conductive objects in the stack,the semi-conductive material springs back to an original form thereof when the direct contact between the stack and the semi-conductive material is ended, andsaid conductive layer is free of direct contact with the stack of objects when the semi-conductive material is in direct contact with said side of the stack.
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Abstract
A method for holding together an electrically non-conductive stack of objects, such as a stack of magazines or foil strips includes forming the stack of objects; and applying to one side of the stack a static polarity with a planar, semi-conductive electrode.
11 Citations
17 Claims
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1. Method of holding together electrically non-conductive objects, comprising:
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forming a stack of the electrically non-conductive objects; and applying to a side of the stack a static polarity with a planar electrode to electrostatically holding the objects together; wherein the planar electrode comprises a conductive layer, and a layer of semi-conductive material that covers the conductive layer and defines an outermost surface of the planar electrode; and wherein said applying comprises; connecting the conductive layer to a static electricity source, and directly contacting the semi-conductive material with said side of the stack to apply static electricity from the static electricity source, via the conductive layer to the semi-conductive material, and then to said side of the stack; wherein the semi-conductive material is elastically deformable, the semi-conductive material deforms upon direct contact with said side of the stack to ensure close contact and homogeneous transfer of the static electricity to the electrically non-conductive objects in the stack, the semi-conductive material springs back to an original form thereof when the direct contact between the stack and the semi-conductive material is ended, and said conductive layer is free of direct contact with the stack of objects when the semi-conductive material is in direct contact with said side of the stack. - View Dependent Claims (2, 3, 4, 5)
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6. Device for holding together an electrically non-conductive stack of objects, said device comprising
a placing location for the stack of objects; - and
at least one planar electrode for applying a static polarity to a surface of the stack; wherein the planar electrode includes; a conductive layer for electrical connection to a static electricity source, and a layer of semi-conductive material that covers the conductive layer and defines an outermost surface of the planar electrode for directly contacting the surface of the stack and transferring static electricity from the static electricity source, via the conductive layer to the semi-conductive material, and then to said surface of the stack; wherein the semi-conductive material is elastically deformable, the semi-conductive material is configured to deform upon direct contact with said surface of the stack to ensure close contact and homogeneous transfer of the static electricity to the electrically non-conductive objects in the stack, the semi-conductive material is configured to spring back to an original form thereof when the direct contact between the stack and the semi-conductive material is ended, and said conductive layer is configured to be free of direct contact with the stack of objects when the semi-conductive material is in direct contact with said surface of the stack. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification