Solid state light sheet for general illumination having metal interconnector through layer for connecting dies in series

• US 8,242,518 B2
• Filed: 04/04/2011
• Issued: 08/14/2012
• Est. Priority Date: 08/27/2010
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Lerman, Louis, York, Allan Brent, Henry, Michael David, Steele, Robert, Ogonowsky, Brian D.
• Primary Examiner(s): Li, Meiya
• Application Number:
  US13/079,717
• Publication Number:
  US 20110193106A1
• Time in Patent Office: 498 Days
• Field of Search: 257 80- 82, 257/88, 257/89, 257/95, 257 98-100, 257/E33.056, 257/E33.061, 438/25, 438/28, 438/34, 438/FOR.157, 438/FOR.287, 438/FOR.46, 362/217.01, 362/249.02, 362/311.02, 362/363, 362/545, 362/555, 362611-613, 362/800, 313/483, 313498-502
• US Class Current: 257/88
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

Claims

1. A lighting device comprising:

a first substrate having first connection locations electrically connected to first conductors formed on the first substrate;

a plurality of non-packaged light emitting dies, each of the plurality of non-packaged light emitting dies having a first die electrode and a second die electrode, the first die electrodes being aligned with and electrically connected to the first connection locations, respectively, without wire bonds;

an intermediate layer over the first substrate, the intermediate layer having first holes corresponding to locations of the plurality of non-packaged light emitting dies on the first substrate such that each of the plurality of non-packaged light emitting dies is surrounded by walls of a corresponding first hole, a thickness of the intermediate layer being approximately a thickness of each of the non-packaged light emitting dies, the intermediate layer also having second holes corresponding to locations of electrical interconnectors, the second holes extending substantially through the thickness of the intermediate layer; and

a second substrate, the intermediate layer disposed between the first substrate and the second substrate, the second substrate having second connection locations electrically connected to second conductors formed on the second substrate, the second die electrodes being substantially aligned with and electrically connected to the second connection locations, respectively, without wire bonds;

wherein the plurality of non-packaged light emitting dies are sandwiched between the first substrate and the second substrate, wherein some of the first conductors and some of the second conductors are interconnected by the electrical interconnectors to create a series connection of at least some of the plurality of non-packaged light emitting dies without using wire bonds, and wherein at least one of the first substrate and second substrate has light passing locations for emitting light.

2. The device of claim 1, wherein the electrical interconnectors are metal units that are physically positioned within the second holes, the electrical interconnects being respectively bonded to the first connectors and the second connectors.

3. The device of claim 1, wherein

the plurality of non-packaged light emitting dies are vertical light emitting diodes, each of the vertical light emitting diodes having a cathode electrode as the second die electrode and an anode electrode as the first die electrode, wherein the vertical light emitting diodes are connected in series such that the anode of one of the plurality of vertical light emitting diodes is electrically coupled to the cathode of an adjacent one of the plurality of vertical light emitting diodes through an electrical connection.

4. The device of claim 1, wherein at least one of the first conductors and the second conductors are exposed after the plurality of non-packaged light emitting dies are sandwiched between the first substrate and the second substrate in order to connect the first conductors or the second conductors to a source of current.

5. The device of claim 1, wherein each of the first holes includes an encapsulant, wherein the encapsulants substantially encapsulate the plurality of non-packaged light emitting dies, respectively.

6. The device of claim 5, wherein the encapsulant further contains a wavelength converting material.

7. The device of claim 1, further including a wavelength converting material, wherein the wavelength converting material is provided proximate to at least some of the plurality of non-packaged light emitting dies to create an alternative composition of light wavelengths.

8. The device of claim 1, further comprising a phosphor layer over a surface of the second substrate to create an alternative composition of light wavelengths.

9. The device of claim 1, wherein the intermediate layer further comprises optical structures configured and arranged to redirect out of the intermediate layer at least a portion of light from within the intermediate layer.

10. The device of claim 9, wherein the optical structures comprise reflective structures.