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Dual thin film precision resistance trimming

  • US 8,242,876 B2
  • Filed: 09/17/2009
  • Issued: 08/14/2012
  • Est. Priority Date: 09/17/2008
  • Status: Active Grant
First Claim
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1. A trimmable resistance structure, comprising:

  • an integrated circuit die having components in a semiconductor substrate;

    a resistive structure in the integrated circuit die composed of a material whose resistance is permanently changeable by application of heat thereto;

    a dielectric in the integrated circuit die disposed adjacent to the resistive structure;

    a heater in the integrated circuit die disposed adjacent to the dielectric, the dielectric being disposed so as to separate the heater from the resistive structure; and

    a switch in the integrated circuit die configured to selectively couple the heater to a voltage supply that will cause heat from the heater to heat the resistive structure to cause a permanent change in the resistive structure.

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