Optical pointing device with integrated optical components and related electronic apparatus

• US 8,243,016 B2
• Filed: 05/17/2009
• Issued: 08/14/2012
• Est. Priority Date: 09/05/2008
• Status: Active Grant

• Current Assignee: PixArt Imaging Incorporated
• Original Assignee: PixArt Imaging Incorporated
• Inventors: Chen, Hui-Hsuan, Liu, Tien-Chia
• Primary Examiner(s): Mengistu, Amare
• Assistant Examiner(s): Sharifi-Tafreshi, Koosha
• Application Number:
  US12/467,298
• Publication Number:
  US 20100060578A1
• Time in Patent Office: 1,185 Days
• Field of Search: 345/156, 345/163, 345/166, 345/173, 345/175
• US Class Current: 345/156
• CPC Class Codes: G06F 3/042 by opto-electronic means

Abstract

According to the claimed invention, an optical pointing device includes a cover having a transparent part, and a sensing component installed inside the cover. The sensing component includes a light emitting module for emitting light, and a light sensing module for sensing light transmitted from the transparent part. The optical pointing device further includes a light guiding component installed between the sensing component and the cover. The light guiding component includes a reflecting part for reflecting the light emitted from the light emitting module to the transparent part, and a condensing part integrated with the reflecting part monolithically for condensing light transmitted from the transparent part to the light sensing module. The light emitted from the light emitting module is reflected to the transparent part by the reflecting part and then reflected back to the transparent part and the condensing part by a shelter disposed above the cover.

Claims

1. An optical pointing device comprising:

a cover comprising a transparent part where light passes through;

a sensing component installed inside the cover, the sensing component comprising;

a light emitting module for emitting light;

a light sensing module for sensing light transmitted from the transparent part so as to generate a corresponding sensing signal; and

a substrate for supporting the light emitting module and the light sensing module; and

a light guiding component installed between the sensing component and the cover, the light guiding component comprising;

a reflecting part for reflecting the light emitted from the light emitting module to the transparent part;

a condensing part integrated with the reflecting part monolithically for condensing light transmitted from the transparent part to the light sensing module, the condensing part being a prism structure, two surfaces of the condensing part respectively facing the transparent part of the cover and the light sensing module being convex surfaces, a surface of the cover facing the condensing part being a concave surface, a chamber being formed between the condensing part and the cover, and a chamber being formed between the condensing part and the sensing component; and

a fixing structure monolithically integrated with the reflecting part and the condensing part to form a single integral and gaplessly continuous optical structure, for combining with the cover and the substrate so as to fix the light guiding component and the sensing component inside the cover;

wherein the light emitted from the light emitting module is reflected to the transparent part by the reflecting part and then reflected back to the transparent part and the condensing part by a shelter disposed above the cover, and the condensing part is for condensing the light transmitted from the transparent part to the light sensing module.

2. The optical pointing device of claim 1 wherein the transparent part of the cover is made of material with infrared transmissivity or dyeing plastic material.

3. The optical pointing device of claim 1 wherein the light emitting module is a light emitting chip.

4. The optical pointing device of claim 3 wherein the light emitting chip is a light emitting diode (LED) or a laser diode.

5. The optical pointing device of claim 3 wherein the light emitting chip is a light emitting chip with a plastic leaded chip carrier (PLCC) packaging process or with a surface mounting device (SMD) packaging process.

6. The optical pointing device of claim 1 wherein the sensing component further comprises an encapsulation for covering the light emitting module and the light sensing module.

7. The optical pointing device of claim 6 wherein the encapsulation is made of epoxy resin or silica gel material.

8. The optical pointing device of claim 1 wherein the sensing component further comprises a lid for covering the light emitting module and the light sensing module.

9. The optical pointing device of claim 1 wherein the light guiding component further comprises a refracting part integrated with the reflecting part and the condensing part monolithically and disposed on an optical path between the light emitting module and the reflecting part for refracting the light emitted from the light emitting module to the reflecting part, an angle between a reflecting surface of the reflecting part and the refracting part is less than 90 degrees, a surface of the refracting part facing the light emitting module is a convex surface, and a chamber is formed between the refracting part and the sensing component.

10. The optical pointing device of claim 1 wherein the reflecting part is a prism structure, and a chamber is formed between the reflecting part and the cover.

11. The optical pointing device of claim 1 being an optical joystick or an optical touch device.

12. An electronic apparatus comprising:

an optical pointing device comprising;

a cover comprising a transparent part where light passes through;

a sensing component installed inside the cover, the sensing component comprising;

a light emitting module for emitting light;

a light sensing module for sensing light transmitted from the transparent part so as to generate a corresponding sensing signal; and

a substrate for supporting the light emitting module and the light sensing module; and

a light guiding component installed between the sensing component and the cover, the light guiding component comprising;

a reflecting part for reflecting the light emitted from the light emitting module to the transparent part;

a condensing part integrated with the reflecting part monolithically for condensing light transmitted from the transparent part to the light sensing module, the condensing part being a prism structure, two surfaces of the condensing part respectively facing the transparent part of the cover and the light sensing module being convex surfaces, a surface of the cover facing the condensing part being a concave surface, a chamber being formed between the condensing part and the cover, and a chamber being formed between the condensing part and the sensing component; and

a fixing structure monolithically integrated with the reflecting part and the condensing part to form a single integral and gaplessly continuous optical structure, for combining with the cover and the substrate so as to fix the light guiding component and the sensing component inside the cover; and

a control unit electrically connected to the light sensing module for controlling operation of the electronic apparatus according to the sensing signal transmitted from the light sensing module;

wherein the light emitted from the light emitting module is reflected to the transparent part by the reflecting part and then reflected back to the transparent part and the condensing part by a shelter disposed above the cover, and the condensing part is for condensing the light transmitted from the transparent part to the light sensing module.

13. The electronic apparatus of claim 12 wherein the transparent part of the cover is made of material with infrared transmissivity or dyeing plastic material.

14. The electronic apparatus of claim 12 wherein the light emitting module is a light emitting chip.

15. The electronic apparatus of claim 14 wherein the light emitting chip is a light emitting diode or a laser diode.

16. The electronic apparatus of claim 14 wherein the light emitting chip is a light emitting chip with a plastic leaded chip carrier packaging process or with a surface mounting device packaging process.

17. The electronic apparatus of claim 12 wherein the sensing component further comprises an encapsulation for covering the light emitting module and the light sensing module.

18. The electronic apparatus of claim 17 wherein the encapsulation is made of epoxy resin or silica gel material.

19. The electronic apparatus of claim 12 wherein the sensing component further comprises a lid for covering the light emitting module and the light sensing module.

20. The electronic apparatus of claim 12 wherein the light guiding component further comprises a refracting part integrated with the reflecting part and the condensing part monolithically and disposed on an optical path between the light emitting module and the reflecting part for refracting the light emitted from the light emitting module to the reflecting part, an angle between a reflecting surface of the reflecting part and the refracting part is less than 90 degrees, a surface of the refracting part facing the light emitting module is a convex surface, and a chamber is formed between the refracting part and the sensing component.

21. The electronic apparatus of claim 12 wherein the reflecting part is a prism structure, and a chamber is formed between the reflecting part and the cover.