System and method for creating a focus-exposure model of a lithography process

• US 8,245,160 B2
• Filed: 09/23/2011
• Issued: 08/14/2012
• Est. Priority Date: 08/08/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Ye, Jun, Cao, Yu, Chen, Luoqi, Liu, Hua-Yu
• Primary Examiner(s): LEVIN, NAUM B
• Application Number:
  US13/244,051
• Publication Number:
  US 20120017183A1
• Time in Patent Office: 326 Days
• Field of Search: 716/50, 430/5
• US Class Current: 716/50
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70641 Focus

Abstract

A system and a method for creating a focus-exposure model of a lithography process are disclosed. The system and the method utilize calibration data along multiple dimensions of parameter variations, in particular within an exposure-defocus process window space. The system and the method provide a unified set of model parameter values that result in better accuracy and robustness of simulations at nominal process conditions, as well as the ability to predict lithographic performance at any point continuously throughout a complete process window area without a need for recalibration at different settings. With a smaller number of measurements required than the prior-art multiple-model calibration, the focus-exposure model provides more predictive and more robust model parameter values that can be used at any location in the process window.

Claims

1. A computer-implemented method for creating a model of a lithography process having a process window, comprising:

defining a set of model parameters and a set of fitting parameters having variable values for the model, the set of model parameters defining a parameter space;

obtaining a calibrated model by analyzing, using the computer, the model parameters and fitting parameters at a plurality of sampling locations within the process window, the plurality of sampling locations being a discrete subset of all possible process conditions within the process window, the calibrated model including values of the set of fitting parameters;

identifying a selected location in the process window that is different from any of the sampling locations; and

generating the model for the selected location using the calibrated model by varying the model parameters in accordance with the selected location while keeping the fitting parameters constant.

2. The method of claim 1 wherein obtaining the calibrated model includes:

simulating, using the computer, the lithography process at each of the plurality of sampling locations using the model parameters to produce simulated results, wherein values of the model parameters are varied to correspond to process conditions corresponding to the sampling locations and the fitting parameters are held constant; and

comparing the simulated results with actual results of the lithography process at all of the plurality of sampling locations.

3. The method of claim 2, further comprising:

selecting a set of test patterns for a test mask, wherein the set of test patterns covers a full range of proximity interactions that are characteristic of the lithography process;

printing the set of test patterns on a wafer to form a set of test structures; and

using the set of test structures to produce the actual results.

4. The method of claim 2, wherein the simulated results and the actual results are critical dimension values.

5. The method of claim 2, wherein calibrating the model includes minimizing a cost function that is calculated based on the comparison of the simulated results with the actual results.

6. The method of claim 5, wherein the cost function includes a root-mean-square (RMS) distance between the simulated results and the actual results.

7. The method of claim 1, wherein the set of model parameters includes one or more first principle parameters.

8. The method of claim 7, wherein the one or more first principle parameters includes one or more of illumination source, numerical aperture, and optical aberrations.

9. The method of claim 1, wherein the model parameters comprise parameters of a resist model module.

10. The method of claim 1, wherein the model parameters comprise parameters of a mask model module.

11. The method of claim 1, wherein the plurality of sampling locations includes only process conditions at nominal exposure and varying values of focus.

12. The method of claim 1, wherein the plurality of sampling locations includes only nominal condition, a positive defocus condition at nominal exposure condition, and a negative defocus condition at nominal exposure condition.

13. A computer-implemented method for generating a model of a lithography process capable of simulating the lithography process over a process window, the model having a set of model parameters that define a parameter space, the method comprising:

identifying a set of test patterns;

analyzing the set of test patterns to determine amount of coverage of the parameter space;

obtaining characteristics of a set of test structures corresponding to the set of test patterns printed on a wafer using the lithography process at each of a set of process conditions, the set of process conditions being a subset of all possible process conditions within the process window;

simulating, using the computer, the lithography process at each of the set of process conditions using a set of parameters corresponding to the model of the lithography process to produce simulated results, the set of parameters including the model parameters and a set of fitting parameters having variable values;

determining values of the fitting parameters that produce simulated results that are a best fit with the characteristics of the set of test structures at all of the set of process conditions; and

defining the model having the values of the fitting parameters.

14. The method of claim 13, wherein the model parameters include one or more first principle parameters in addition to focus and exposure.

15. The method of claim 14, wherein the one or more first principle parameters includes one or more of illumination source, numerical aperture, and optical aberrations.

16. The method of claim 13, wherein the model parameters include parameters of a resist model module.

17. The method of claim 13, wherein the model parameters include parameters of a mask model module.

18. The method of claim 13, wherein the set of process conditions include only process conditions at nominal exposure and varying values of focus.

19. The method of claim 13, wherein the set of process conditions include only nominal condition, a positive defocus condition at nominal exposure condition, and a negative defocus condition at nominal exposure condition.

20. The method of claim 13, wherein analyzing includes a two-dimensional frequency space analysis of the test patterns.

21. The method of claim 13, wherein the amount of coverage of the parameter space is determined by analysis of estimated process windows using one or more of the following:

using nominal simulation parameters, using default simulation parameters, and, using best-effort approach.