Component and production method for a component

• US 8,245,571 B2
• Filed: 11/03/2009
• Issued: 08/21/2012
• Est. Priority Date: 11/10/2008
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Pannek, Thorsten, Gomez, Udo-Martin, Muenzel, Horst
• Primary Examiner(s): Allen, Andre
• Application Number:
  US12/611,634
• Publication Number:
  US 20100116043A1
• Time in Patent Office: 1,022 Days
• Field of Search: 73146-1465
• US Class Current: 73/146.5
• CPC Class Codes: B60C 23/0408 transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
• CPC Class Codes: B60C 23/0433 Radio signals
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A component having an acceleration sensor having at least one freely oscillatory mass, and a resonator having at least one resonating structure, in which the at least one freely oscillatory mass of the acceleration sensor and the at least one resonating structure of the resonator are disposed on and/or in one chip. A corresponding production method for a component is also described.

Claims

1. A component, comprising:

an acceleration sensor having at least one freely oscillatory mass; and

a resonator having at least one resonating structure;

wherein the at least one freely oscillatory mass of the acceleration sensor and the at least one resonating structure of the resonator are disposed at least one of on and in one chip.

2. The component of claim 1, wherein at least one of the at least one freely oscillatory mass of the acceleration sensor and the at least one resonating structure of the resonator are formed from a semiconductor material.

3. The component of claim 1, wherein the at least one freely oscillatory mass of the acceleration sensor projects at least partially into a first internal volume having a first internal pressure, and the at least one resonating structure of the resonator projects at least partially into a second internal volume having a second internal pressure, which is different from the first internal pressure.

4. The component of claim 1, wherein the component includes a phase-locked loop with a voltage-controlled oscillator, which is coupled to the resonator so that a reference signal having a reference frequency provided by the resonator may be provided to the phase-locked loop.

5. The component of claim 4, further comprising:

a transmitter chip configured to generate a transmission signal by way of the phase-locked loop, the voltage-controlled oscillator and the reference signal having the reference frequency provided by the resonator.

6. The component of claim 1, further comprising:

a pressure sensor device configured to ascertain information in respect of a pressure in an external volume of the component and to provide a corresponding information signal.

7. The component of claim 6, wherein the component is a tire pressure sensor.

8. A method for producing a component, the method comprising:

forming an acceleration sensor having at least one freely oscillatory mass; and

forming a resonator having at least one resonating structure;

wherein the at least one freely oscillatory mass of the acceleration sensor and the at least one resonating structure of the resonator are formed at least one of on and in one chip.

9. The method of claim 8, further comprising:

structuring a plurality of freely oscillatory masses out of a semiconductor layer on a substrate;

structuring a plurality of resonating structures out of the semiconductor layer on the substrate;

subdividing the substrate into the at least one chip with the at least one freely oscillatory mass and with the at least one resonating structure.

10. The production method of claim 9, wherein at least one of the plurality of freely oscillatory masses and the plurality of resonating structures are formed using at least one thin-layer capping process.