Method of molding a microneedle
First Claim
Patent Images
1. A method of molding a microneedle array comprising:
- (i) providing a mold apparatus comprising;
a mold insert having the negative image of at least one microneedle;
a compression core; and
a mold housing configured to allow a reciprocal motion between the mold insert and the compression core,wherein the mold apparatus has an open position and a closed position;
(ii) placing the mold apparatus in the closed position;
(iii) applying acoustic energy having a frequency greater than about 5,000 Hz to the mold apparatus;
(iv) injecting polymeric material into the closed mold apparatus;
(v) compressing the injected polymeric material between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert;
(vi) opening the mold; and
(vii) removing the molded microneedle from the mold.
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Abstract
A method of molding a microneedle using a mold apparatus that includes the use of high frequency acoustic energy, such as ultrasonic energy.
98 Citations
13 Claims
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1. A method of molding a microneedle array comprising:
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(i) providing a mold apparatus comprising; a mold insert having the negative image of at least one microneedle; a compression core; and a mold housing configured to allow a reciprocal motion between the mold insert and the compression core, wherein the mold apparatus has an open position and a closed position; (ii) placing the mold apparatus in the closed position; (iii) applying acoustic energy having a frequency greater than about 5,000 Hz to the mold apparatus; (iv) injecting polymeric material into the closed mold apparatus; (v) compressing the injected polymeric material between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert; (vi) opening the mold; and (vii) removing the molded microneedle from the mold. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification