Resistively heated small planar filament

• US 8,247,971 B1
• Filed: 08/15/2011
• Issued: 08/21/2012
• Est. Priority Date: 03/19/2009
• Status: Expired due to Fees

• Current Assignee: Moxtek Inc (Nippon Kayaku Company Limited)
• Original Assignee: Moxtek Inc (Nippon Kayaku Company Limited)
• Inventors: Bard, Erik C., Cornaby, Sterling W.
• Primary Examiner(s): Patel, Vip
• Application Number:
  US13/209,862
• Publication Number:
  US 20120212157A1
• Time in Patent Office: 372 Days
• Field of Search: 313/631, 313/491, 313/310
• US Class Current: 313/631
• CPC Class Codes: H01J 1/16 characterised by the shape
• CPC Class Codes: H01J 1/18 Supports; Vibration-damping arrangements
• CPC Class Codes: H01J 2201/2857 being coiled
• CPC Class Codes: H01J 2201/2871 being flattened
• CPC Class Codes: H01J 35/064 Details of the emitter, e.g. material or structure H01J35/065 takes precedence
• CPC Class Codes: H01K 1/14 characterised by the shape

Abstract

A planar filament comprising two bonding pads and a non-linear filament connected between the two bonding pads. The planar filament may be wider in the center to increase filament life. The planar filament can form a double spiral-serpentine shape. The planar filament may be mounted on a substrate for easier handling and placement. Voltage can be used to create an electrical current through the filament, and can result in the emission of electrons from the filament. The planar filament can be utilized in an x-ray tube.

Claims

1. An electron emitter device comprising:

a. a pair of spaced-apart bonding pads configured to receive an electrical connection;

b. an elongated planar filament extending between the pair of bonding pads in a planar layer, the planar filament configured to receive an applied electric current therethrough;

c. the planar filament being substantially flat with planar top and bottom surfaces;

d. the planar filament having a length and a width in the planar layer transverse to the length; and

e. the planar filament winding in an arcuate path in the planar layer between the pair of bonding pads defining;

i. a central spiral segment with the planar filament forming at least one complete revolution about an axis at a center of the planar filament, on either side of the axis, the planar filament forming a double spiral shape oriented parallel to the layer, and

ii. a pair of serpentine segments on different opposite sides of the spiral segment with each serpentine segment including at least one change in direction;

f. the planar filament being continuous and uninterrupted across the width along an entire length of the planar filament and defining a single current path along the length between the pair of bonding pads;

g. the planar filament having a non-uniform width measured in a plane of the layer and transverse to a length of the planar filament; and

h. the planar filament including a wider, intermediate portion having a wider width that is greater than narrower portions on opposite ends of the intermediate portion, the wider width being at least twice as wide as the narrower portions, and the wider portion being disposed substantially at the axis at the center of the planar filament.

2. The device of claim 1, wherein a minimum width of the planar filament is less than 100 micrometers.

3. The device of claim 1, wherein the wider width of the intermediate portion is at least four times as wide as the narrower portions.

4. The device of claim 1, wherein each serpentine segment:

a. includes at least two changes in direction, and

b. forms at least two incomplete revolutions about the axis in opposite directions.

5. The device of in claim 1, further comprising at least one beam shaping pad also defined by the layer, and disposed adjacent to and spaced-apart from the planar filament.

6. The device of claim 1, wherein the planar filament has a substantially constant width along a majority of the length of the planar filament except for the intermediate portion.

7. A filament device comprising:

a. a pair of spaced-apart bonding pads configured to receive an electrical connection;

b. an elongated planar filament extending between the pair of bonding pads in a planar layer;

c. the planar filament being substantially flat with planar top and bottom surfaces;

d. the planar filament having a length and a width in the planar layer transverse to the length;

e. the planar filament being continuous and uninterrupted, across the width along an entire length of the planar filament and defining a single current path along the length between the pair of bonding pads; and

f. an intermediate portion of the planar filament having a wider width that is greater than narrower portions on opposite ends of the intermediate portion, the wider width being at least two times wider than narrower portions.

8. The device of claim 7, wherein the planar filament has a substantially constant width along a majority of the length of the planar filament except for the intermediate portion.

9. The device of in claim 7, further comprising:

a. a vacuum enclosure disposed about the planar filament;

b. a cathode coupled to the vacuum enclosure and the planar filament;

c. an anode coupled to the vacuum enclosure and opposing the cathode; and

d. a power source electrically coupled to the pair of bonding pads to apply the electric current through the planar filament to cause the planar filament to release electrons, and a high voltage power supply being electrically coupled to the cathode and the anode to form a voltage differential therebetween to cause the electrons to accelerate to the anode.

10. The device of claim 7, wherein:

a. the planar filament winds in an arcuate in the planar layer between the pair of bonding pads defining a center spiral segment with the planar filament forming at least one complete revolution about an axis at a center of the planar filament, on either side of the axis, the planar filament forming a double spiral shape oriented parallel to the layer; and

b. the intermediate portion is disposed substantially at the axis at the center of the planar filament.

11. The device of claim 10, wherein the planar filament includes a pair of serpentine segments on different opposite sides of the spiral segment in which each serpentine segment extends in a first direction about an axis and doubles-back in a second direction about the axis defining a serpentine path.

12. The device of claim 11, wherein each serpentine segment:

a. includes at least two changes in direction, and

b. forms at least two incomplete revolutions about the axis in opposite directions.

13. The device of in claim 7, further comprising at least one beam shaping pad also defined by the layer, and disposed adjacent to and spaced-apart from the planar filament.

14. The device of claim 7, wherein a minimum width of the planar filament is less than 50 micrometers.

15. A filament device comprising:

a. a pair of spaced-apart bonding pads configured to receive an electrical connection;

b. an elongated planar filament extending between the pair of bonding pads in a planar layer;

c. the planar filament being substantially flat with planar top and bottom surfaces;

d. the planar filament having a length and a width in the planar layer transverse to the length; and

e. the planar filament winding in an arcuate path in the planar layer between the pair of bonding pads defining;

i. a center spiral segment with the planar filament forming at least one complete revolution about an axis at a center of the planar filament, on either side of the axis, the planar filament forming a double spiral shape oriented parallel to the layer, and

ii. a pair of serpentine segments on different opposite sides of the spiral segment with each serpentine segment including at least one change in direction.

16. The device of claim 15, wherein

a. the planar filament is continuous and uninterrupted, across the width along an entire length of the planar filament and defines a single current path along the length between the pair of bonding pads;

b. an intermediate portion of the planar filament has a wider width that is greater than narrower portions on opposite ends of the intermediate portion, the wider width being at least 50% wider than narrower portions; and

c. the planar filament has a substantially constant width along a majority of the length of the planar filament except for the intermediate portion.

17. The device of claim 15, further comprising the planar filament being continuous and uninterrupted across the width along an entire length of the planar filament and defining a single current path along the length between the pair of bonding pads.

18. The device of claim 15, further comprising an intermediate portion of the planar filament having a wider width greater than narrower portions on opposite ends of the intermediate portion, the wider width of the intermediate portion being at least 50% wider than narrower portions.

19. The device of in claim 15, further comprising at least one beam shaping pad also defined by the layer, and disposed adjacent to and spaced-apart from the planar filament.

20. The device of in claim 15, further comprising:

a. a vacuum enclosure disposed about the planar filament;

b. a cathode coupled to the vacuum enclosure and the planar filament;

c. an anode coupled to the vacuum enclosure and opposing the cathode; and

d. a power source electrically coupled to the pair of bonding pads to apply the electric current through the planar filament to cause the planar filament to release electrons, and a high voltage power supply being electrically coupled to the cathode and the anode to form a voltage differential therebetween to cause the electrons to accelerate to the anode.