Molding device for an expandable interspinous process implant

• US 8,252,031 B2
• Filed: 04/28/2006
• Issued: 08/28/2012
• Est. Priority Date: 04/28/2006
• Status: Expired due to Fees

• Current Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Original Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Inventors: Carls, Thomas, Anderson, Kent M., Lange, Eric C., Lim, Roy, Trieu, Hai H., Bruneau, Aurelien
• Primary Examiner(s): Stewart, Alvin
• Assistant Examiner(s): COMSTOCK, DAVID C
• Application Number:
  US11/414,445
• Publication Number:
  US 20070270829A1
• Time in Patent Office: 2,314 Days
• Field of Search: 606/247, 606/248, 606/249, 623 1711- 1716
• US Class Current: 606/279
• CPC Class Codes: A61B 17/7065 Devices with changeable shape, e.g. collapsible or having retractable arms to aid implantation; Tools therefor
• CPC Class Codes: A61B 2017/00557 inflatable A61B2017/22051 takes precedence
• CPC Class Codes: B29C 33/26 by pivotal movement
• CPC Class Codes: B29C 45/03 Injection moulding apparatus transfer moulding B29C45/02
• CPC Class Codes: B29K 2105/0035 Medical or pharmaceutical agents
• CPC Class Codes: B29L 2031/753 Medical equipment; Accessories therefor bloodbags, medical bags B29L2031/7148; artificial eyes B29L2011/0008

Abstract

A molding device is disclosed and can include a first mold component and a second mold component substantially opposite the first mold component. The first mold component and the second mold component can fit around a superior spinous process and an inferior spinous process.

Claims

1. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing distinct first and second portions of a molding device around the expandable interspinous process implant such that;

the first portion laterally limits the implant and is disposed on a first lateral side of the sagittal plane defined by the superior and inferior spinous processes;

the second portion laterally limits the implant and is disposed on a second opposite lateral side of the sagittal plane;

expanding the expandable interspinous process implant;

removing the first and second portions of the molding device from around the interspinous process implant while maintaining the expanded interspinous process implant between the superior and inferior spinous processes;

wherein the expandable interspinous process implant at least partially conforms to a volume bound by the molding device, the superior spinous process, and the inferior spinous process; and

further comprising curing an injectable biocompatible material within the expandable interspinous process implant.

2. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing distinct first and second portions of a molding device around the expandable interspinous process implant such that;

the first portion laterally limits the implant and is disposed on a first lateral side of the sagittal plane defined by the superior and inferior spinous processes;

the second portion laterally limits the implant and is disposed on a second opposite lateral side of the sagittal plane;

expanding the expandable interspinous process implant;

removing the first and second portions of the molding device from around the interspinous process implant while maintaining the expanded interspinous process implant between the superior and inferior spinous processes;

wherein said installing comprises rotating the molding device from a closed position to an open position.

3. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing distinct first and second portions of a molding device around the expandable interspinous process implant such that;

the first portion laterally limits the implant and is disposed on a first lateral side of the sagittal plane defined by the superior and inferior spinous processes;

the second portion laterally limits the implant and is disposed on a second opposite lateral side of the sagittal plane;

expanding the expandable interspinous process implant;

removing the first and second portions of the molding device from around the interspinous process implant while maintaining the expanded interspinous process implant between the superior and inferior spinous processes;

wherein expanding the implant occurs prior to said installing the first and second portions of the molding device.

4. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing distinct first and second portions of a molding device around the expandable interspinous process implant such that;

the first portion laterally limits the implant and is disposed on a first lateral side of the sagittal plane defined by the superior and inferior spinous processes;

the second portion laterally limits the implant and is disposed on a second opposite lateral side of the sagittal plane;

expanding the expandable interspinous process implant;

removing the first and second portions of the molding device from around the interspinous process implant while maintaining the expanded interspinous process implant between the superior and inferior spinous processes;

further comprising adding a curable fluid through an injection tube into the implant;

removing the injection tube from the implant, wherein removing the injection tube occurs prior to installing the molding device.

5. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing distinct first and second portions of a molding device around the expandable interspinous process implant such that;

the first portion laterally limits the implant and is disposed on a first lateral side of the sagittal plane defined by the superior and inferior spinous processes;

the second portion laterally limits the implant and is disposed on a second opposite lateral side of the sagittal plane;

expanding the expandable interspinous process implant;

removing the first and second portions of the molding device from around the interspinous process implant while maintaining the expanded interspinous process implant between the superior and inferior spinous processes;

wherein said expanding the implant distracts the superior and inferior spinous processes.