Protection layer for adhesive material at wafer edge
First Claim
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1. A method, comprising:
- providing a wafer having a first surface and a second surface opposite to the first surface;
attaching the first surface of the wafer to a carrier by using an adhesive layer, exposing a portion of the adhesive layer adjacent to an edge of the wafer;
thinning the wafer from the second surface, forming a thinned wafer;
forming a protection layer to cover the exposed portion of the adhesive layer;
bonding a plurality of dies onto the thinned wafer; and
encapsulating the thinned wafer and the plurality of dies with a molding compound.
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Abstract
A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is provided to cover the exposed portion of the adhesive layer. A plurality of dies is bonded onto the thinned wafer, and then the thinned wafer and the dies are encapsulated with a molding compound.
46 Citations
20 Claims
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1. A method, comprising:
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providing a wafer having a first surface and a second surface opposite to the first surface; attaching the first surface of the wafer to a carrier by using an adhesive layer, exposing a portion of the adhesive layer adjacent to an edge of the wafer; thinning the wafer from the second surface, forming a thinned wafer; forming a protection layer to cover the exposed portion of the adhesive layer; bonding a plurality of dies onto the thinned wafer; and encapsulating the thinned wafer and the plurality of dies with a molding compound. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method, comprising:
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providing a wafer having a first surface and a second surface opposite to the first surface; attaching the first surface of the wafer to a carrier by using an adhesive layer, exposing a portion of the adhesive layer adjacent to an edge of the wafer; thinning the wafer from the second surface, forming a thinned wafer; forming a protection layer to cover the exposed portion of the adhesive layer, and the edge of the wafer; bonding a die onto the thinned wafer; encapsulating the thinned wafer and the die with a molding compound; and removing the carrier. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification