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Cap member and semiconductor device employing same

  • US 8,253,240 B2
  • Filed: 11/24/2008
  • Issued: 08/28/2012
  • Est. Priority Date: 11/29/2007
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a semiconductor chip;

    a support base on which the semiconductor chip is mounted; and

    a cap member fixed on the support base so as to cover the semiconductor chip, the cap member including,a cylindrical side wall portion,a top face portion closing one end of the side wall portion and having an opening formed in a predetermined region therein,a light-transmissive window member fitted to the top face portion so as to stop the opening, anda fitting portion arranged at another end of the side wall portion and fixed on a support base on which a semiconductor chip is mounted,wherein at least one of the side wall portion and the top face portion has grooves formed in both of inner and outer surfaces thereof, the grooves forming a part, less thick than another part, of the at least one of the side wall portion and the top face portion.

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