Electronic component and method for manufacturing electronic component

• US 8,253,301 B2
• Filed: 07/22/2009
• Issued: 08/28/2012
• Est. Priority Date: 08/27/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Nishino, Taro, Iwamoto, Takashi
• Primary Examiner(s): ROSENAU, DEREK JOHN
• Assistant Examiner(s): Gordon, Bryan
• Application Number:
  US12/507,284
• Publication Number:
  US 20100052472A1
• Time in Patent Office: 1,133 Days
• Field of Search: 310/313.A, 310/313.R, 310/324, 310/313.D
• US Class Current: 310/313.D
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 9/02055 of the surface including the back surface
• CPC Class Codes: H03H 9/02094 of adherence
• CPC Class Codes: H03H 9/02228 Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
• CPC Class Codes: H03H 9/02574 of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
• CPC Class Codes: H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/079 using intermediate layers, e.g. for growth control
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.

Claims

1. An electronic component comprising:

a support member;

a piezoelectric film having a pair of principal surfaces substantially parallel to each other and including a first portion that is not supported by the support member and a second portion supported by the support member;

an adhesive layer which is disposed between the support member and the second portion of the piezoelectric film and which is in contact with the support member and the second portion of the piezoelectric film; and

electrodes arranged on at least one of the principal surfaces of the first portion of the piezoelectric film;

wherein

the adhesive layer has a first surface in contact with the support member and a second surface in contact with the second portion of the piezoelectric film and the first surface of the adhesive layer has a roughness greater than that of the second surface thereof.

2. The electronic component according to claim 1, wherein the principal surfaces of the piezoelectric film are mirror surfaces.

3. The electronic component according to claim 1, wherein the electrodes are arranged to excite a plate wave propagating through the piezoelectric film.