Molded memory card with write protection switch assembly

• US 8,254,134 B2
• Filed: 01/08/2010
• Issued: 08/28/2012
• Est. Priority Date: 05/03/2007
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Hiew, Siew S., Ma, Abraham C., Nan, Nan
• Primary Examiner(s): LEVI, DAMEON E
• Application Number:
  US12/684,841
• Publication Number:
  US 20100110647A1
• Time in Patent Office: 963 Days
• Field of Search: 361/737, 361/752, 235/488, 235/441, 235/492, 298/30, 439/945, 439/946, 357/679
• US Class Current: 361/737
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10159 Memory
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot.

Claims

1. A memory card device comprising:

a printed circuit board assembly (PCBA) including;

a printed circuit board (PCB) having opposing first and second surfaces, the printed circuit board (PCB) including,

a plurality of metal contacts mounted on the first surface of the PCB and connected to corresponding conductive traces,

at least one passive component surface mounted on a selected one of the first and second surfaces of the PCB,

at least one integrated circuit (IC) device mounted on said selected one of the first and second surfaces of the PCB;

an integral molded plastic casing comprising thermoset plastic and including an upper wall formed on the first surface, a lower wall formed on the second surface, and opposing first and second walls extending between the upper and lower walls,

wherein the molded plastic casing is formed such that said at least one passive component and said at least one IC device are encased by said thermoset plastic, and

wherein the molded plastic casing includes a pre-molded switch slot includes a cavity that is exposed by a first opening defined between first and second portions of said second side wall and a second opening defined in a portion of the lower wall; and

a write protect switch assembly mounted onto the molded plastic casing, the write protect switch assembly including;

a movable switch button having a base portion movably engaged in the cavity of the pre-molded switch slot, and a button top extending through the first opening; and

a switch cap secured to the lower wall of the molded plastic casing and having a flat wall portion of the switch cap encloses the second opening such that the base portion of the movable switch button is covered by the flat wall portion.

2. The memory card device according to claim 1,

wherein the pre-molded switch slot further comprises two openings disposed at opposite ends of the cavity, and

wherein the write protect switch assembly further comprises a metal rod having ends respectively mounted in the two openings such that the metal rod extends across the cavity, and

wherein the movable switch button is slidably mounted on the metal rod such that the metal rod extends through a through-hole defined in the base portion.

3. The memory card device according to claim 2, wherein the two openings comprise slots defined in the molded plastic casing adjacent to the first and second portions of said second side wall, respectively.

4. The memory card device according to claim 1,

wherein the pre-molded switch slot further comprises a retention wall extending between the first and second portions of said second side wall, and

wherein the movable switch button further defines a retaining slot and is mounted on the molded plastic casing such that the retention wall is slidably received inside the retaining slot.

5. The memory card device according to claim 4, wherein the retention wall is slidably received inside the retaining slot such that the movable switch button is restricted by the retaining wall to move between the first and second portions of said second side wall.

6. The memory card device according to claim 1, wherein the pre-molded switch slot further comprises a positioning bump and the switch button is disposed on the molded plastic casing such that movement of the switch button between a “

read only”

position and “

write allowed”

position is restricted by the positioning bump.

7. The memory card device according to claim 1,

wherein the pre-molded switch slot further defines a support shelf disposed around an edge of said cavity, and a plurality of retention openings that extend downward into support shelf,

wherein the switch cap is mounted on the lower wall of the molded plastic casing such that the flat wall portion is disposed on the support shelf, and

wherein the switch cap further comprises a plurality of protrusions, each of the plurality of protrusions being inserted into an associated one of the plurality of retention openings.

8. The memory card device according to claim 7, wherein the switch cap comprises molded plastic and the plurality of protrusions comprise poles.

9. The memory card device according to claim 7, wherein the switch cap comprises metal and the plurality of protrusions comprise metal hooks.

10. The memory card device according to claim 1, wherein the movable switch button is mounted on the molded plastic casing such that the movable switch button is restricted to move in a direction perpendicular to the second side wall.

11. The memory card device according to claim 1, wherein said upper wall defines a plurality of openings disposed to expose said plurality of metal contacts, and wherein the molded plastic casing further includes a plurality of ribs, each rib being disposed between a corresponding adjacent pair of said openings.

12. The memory card device according to claim 1, wherein the at least one IC device comprises one or more unpackaged integrated circuit (IC) die that are wire bonded to said selected one of the first and second surfaces of the PCB.

13. The memory card device according to claim 12,

wherein said at least one passive component is surface mounted onto a first surface region and secured to first contact pads by solder, and

wherein said at least one unpackaged IC die includes:

a controller IC die mounted on a second surface region of said PCB and secured to second contact pads by first wire bonds, and

a first memory IC die mounted on a third surface region of said PCB and secured to third contact pads by second wire bonds.

14. The memory card device according to claim 13, wherein said at least one unpackaged IC die also includes a second memory IC die mounted on the first memory IC die and secured to the third contact pads by third wire bonds.

15. The memory card device according to claim 12,

wherein said plurality of metal contacts are formed directly on the first surface, and

wherein said at least one passive component and said at least one unpackaged IC die are mounted on said second surface and encased by said second wall of said molded plastic casing.

16. The memory card device according to claim 1, wherein the at least one IC device comprises one or more packaged integrated circuit (IC) die that are surface mounted to said selected one of the first and second surfaces the PCB by solder.

17. The memory card device according to claim 1, wherein the PCBA comprises a transfer molded core including a transfer mold casing formed over the at least one passive component and the at least one IC device.

18. The memory card device according to claim 17, wherein the transfer mold casing has a length that is approximately half of a length of the molded plastic casing.

19. The memory card device according to claim 1, further comprising a metal sheet disposed over the PCBA and secured to the molded plastic casing such that the metal sheet is disposed on an outside surface of the molded plastic casing.

20. The memory card device according to claim 1, wherein said memory card device comprises one of a SD device and a MMC device.

21. A method for producing a plurality of memory card devices, the method comprising:

producing a printed circuit board (PCB) panel including a plurality of PCB regions, each PCB region including a plurality of metal contacts disposed on an upper surface of said each PCB region;

attaching at least one passive component and at least one integrated circuit (IC) device to one of said upper surface and an opposing lower surface of each said PCB region;

mounting the PCB panel into a molding apparatus such that said upper surface of each said PCB region is disposed over a lower molding die and said metal contacts are pressed against raised supports;

forming a molded casing over at least one of the first surface and the second surface of each PCB region such that said at least one passive component and said at least one IC device of each PCB region are covered by thermal set plastic forming upper and lower walls of said molded casing, and such that the molded casing includes a pre-molded switch slot includes a cavity that is exposed by a first opening defined between first and second portions of a side wall of said molded casing, and a second opening defined in a portion of the lower wall;

singulating said PCB panel by cutting said PCB panel such that the PCB panel is separated into said plurality of memory card devices, wherein each memory card device includes a PCB region and a corresponding said molded casing; and

mounting a write protect switch assembly onto the integral molded plastic casing, such that a movable switch button of the write protect switch assembly is mounted with a base portion movably engaged in the cavity of the pre-molded switch slot and a button top extending through the first opening, and a switch cap is secured to the lower wall of molded casing and has a flat wall portion of the switch cap enclosing the second opening such that the base portion of the movable switch button is covered by the flat wall portion.