Metal stencil coin repair method

• US 8,256,084 B1
• Filed: 01/19/2010
• Issued: 09/04/2012
• Est. Priority Date: 01/25/2009
• Status: Expired due to Fees

• Current Assignee: Your DENT Guy Incorporated
• Original Assignee: Your DENT Guy Incorporated
• Inventors: Bishop, James M.
• Primary Examiner(s): Omgba, Essama
• Application Number:
  US12/689,810
• Time in Patent Office: 959 Days
• Field of Search: 294/020.1, 294/021.9, 723/72, 724/58, 724/78, 724/79, 727/05
• US Class Current: 29/402.01
• CPC Class Codes: H05K 13/06 Wiring by machine
• CPC Class Codes: H05K 3/1225 Screens or stencils; Holders therefor
• CPC Class Codes: Y10T 29/49718 Repairing
• CPC Class Codes: Y10T 29/49748 by shaping, e.g., bending, extruding, turning, etc.

Abstract

During the manufacture of printed circuit boards, metal stencils are used as a mask over which a blade is used to squeegee solder through stencil holes onto conducting pads of the circuit board. A typical stencil is both expensive and delicate. Even minor dents, creases, or impressions (commonly referred to as “coins”) in the stencil can result in circuit board defects. Manufacturers frequently suffer significant losses scrapping their coined stencils and idling manufacturing lines while waiting for replacement stencils to be fabricated, shipped, and installed. An apparatus and method is provided for repairing metal stencil coins.

Claims

1. A method for repairing a defective surface protrusion on a metal stencil used in applying solder paste to a circuit board, the method comprising:

mounting the metal stencil so that the defective surface protrusion is facing downward;

enhancing the detectibility of the defective surface protrusion by relatively positioning the metal stencil, a light source, and a visual apparatus, so that light from the light source reflects off of the metal stencil in the immediate vicinity of the defective surface protrusion toward the visual apparatus;

gently pressing a polymerized or polymer-coated tool tip up and against the surface protrusion on the metal stencil;

observing the location and degree of distortions in the reflected light while pressing the polymerized or polymer-coated tool tip up and against the surface protrusion; and

conditioning both the location and the amount of applied pressure upon the observed location and observed degree of distortions in the reflected light.

2. The method of claim 1, further comprising the step of positioning a person'"'"'s chin adjacent a top surface of the metal stencil while positioning at least one of the person'"'"'s hands underneath the mounted metal stencil to hold and manipulate a hand-held tool carrying the tool tip to repair the defective surface protrusion.

3. The method of claim 1, further comprising the step of relatively positioning a frame-mounted magnifying instrument between the defective surface protrusion and the visual apparatus to further enhance the detectibility of the defective surface protrusion.

4. The method of claim 1, further comprising gently rubbing the tool tip up and against the surface protrusion.

5. The method of claim 1, further comprising gently pressing the tool tip up and against the metal stencil around the surface protrusion.

6. The method of claim 1, further comprising pressing the tool tip up and against multiple points of the surface protrusion to gradually and incrementally smooth out the surface protrusion.

7. The method of claim 1, wherein the light source is a straight-line light source, further comprising relatively positioning the metal stencil, the light source, and the visual apparatus so that light from the light source reflects off of the defective surface protrusion and, from the perspective of the visual apparatus, to the right and left of the defective surface protrusion, so that distortions in the linearity of the reflected light pattern reveal the defective surface protrusion.

8. The method of claim 1, wherein the light source is a selectively projectable light source, and the step of relative positioning includes projecting the light source toward the defective surface protrusion in the metal stencil, at an angle, so that its reflection is in the direction of the visual apparatus.

9. The method of claim 1, further comprising the step of providing a customized hand tool with a polymer or polymer-coated tip to press and rub and substantially eliminate the surface protrusion, wherein substantial elimination of the surface protrusion is accomplished when a measure of a displacement of the surface protrusion is reduced below a tolerance specification.

10. The method of claim 1, the method further comprising the step of changing a selected position of the light source through multiple positions to inspect the stencil for coins.

11. The method of claim 1, the method further comprising the step of mounting the stencil on a wheeled repair stand to facilitate adjusting the position of the stencil in relation to the light source, the method further comprising the step of moving the wheeled repair stand through multiple positions in order to inspect the stencil for coins.

12. The method of claim 1, further comprising the step of applying strips of translucent color tapes or masks to the light source to provide a “

straight edge”

in the reflected light.

13. A method for repairing a defective surface protrusion on a metal stencil used in applying solder paste to a circuit board, the method comprising:

enhancing the detectibility of the defective surface protrusion by relatively positioning the metal stencil, a straight-line light source, and a visual apparatus, so that light from the straight-line light source reflects off of the metal stencil in the immediate vicinity of the defective surface protrusion toward the visual apparatus, and so that distortions in the linearity of the reflected light pattern reveal the defective surface protrusion;

gently pressing a polymerized or polymer-coated tool tip up and against the surface protrusion on the metal stencil;

observing the location and degree of distortions in the reflected light while pressing the polymerized or polymer-coated tool tip up and against the surface protrusion; and

conditioning both the location and the amount of applied pressure upon the observed location and observed degree of distortions in the reflected light.

14. A method for repairing a damaged framed metal stencil used in applying solder paste to a printed circuit board, the method comprising:

mounting the frame of the framed metal stencil to a repair stand;

selectively directing light from a light source positioned at a selected location and at a selected angle to the stencil;

inspecting the stencil for coins by observing distortions in reflections of the selectively directed light;

selecting a repair tip for a handle tool having interchangeable tips, the repair tip having a shape, sharpness, bluntness, and depth appropriate for repairing a detected coin;

repairing the selected coin by pressing the handle tool at a selected location of the stencil and at a selected angle to the stencil to substantially eliminate the detected coin; and

viewing the stencil on both sides to evaluate whether the repair was adequate and the surface in the area of the previously-detected coin is substantially flat and free of blemishes.

15. The method of claim 14, further comprising the steps of determining the depth and diameter of the detected coin.

16. The method of claim 14, further comprising the step of adjusting the selected position of the light source to identify an appropriate location on the stencil to which pressure is to be applied to repair the coin.

17. The method of claim 14, wherein the repair stand is a collapsible repair stand, the method further comprising the step of adjusting the width of the collapsible repair stand to a width approximately equal to a width of the framed metal stencil.

18. The method of claim 14, further comprising the step of marking the location of the coin on the stencil.

19. The method of claim 14, further comprising the step of securing the framed metal stencil to the repair stand using ratcheting clamps.

20. The method of claim 14, further comprising the steps of identifying a direction in which a surface protrusion of a detected coin is facing, and re-mounting the metal stencil so that the defective surface protrusion is facing downward.