Micromechanical pressure sensing device
First Claim
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1. A micromechanical pressure sensing device, comprising:
- a semiconductor support structure including a support;
at least one diaphragm attached to and supported by the support; and
at least one piezoresistive sensing device buried in the support, the piezoresistive sensing device being arranged to sense a strain induced in the semiconductor support structure, the strain being inducible by a fluid in contact with the at least one diaphragm, to determine a pressure acting on the at least one diaphragm.
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Abstract
A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.
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Citations
20 Claims
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1. A micromechanical pressure sensing device, comprising:
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a semiconductor support structure including a support; at least one diaphragm attached to and supported by the support; and at least one piezoresistive sensing device buried in the support, the piezoresistive sensing device being arranged to sense a strain induced in the semiconductor support structure, the strain being inducible by a fluid in contact with the at least one diaphragm, to determine a pressure acting on the at least one diaphragm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a micromechanical pressure sensing device, the method comprising:
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structuring a semiconductor substrate to form a semiconductor support structure; burying at least one piezoresistive sensing device in the semiconductor support structure; and attaching at least one diaphragm to the semiconductor support structure such that the at least one diaphragm is supported by the semiconductor support structure, the piezoresistive sensing device being arranged in the semiconductor support structure to sense a strain induced in the semiconductor support structure, the strain being inducible by a fluid in contact with the at least one diaphragm, to determine a pressure acting on the at least one diaphragm. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of operating a micromechanical pressure sensing device, the method comprising:
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inducing a strain in a semiconductor support structure supporting at least one diaphragm, by contacting the at least one diaphragm with a fluid; and sensing the strain induced in the semiconductor support structure with at least one piezoresistive sensing device buried in the semiconductor support structure, to determine a pressure acting on the at least one diaphragm. - View Dependent Claims (19, 20)
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Specification