Efficient LED array
First Claim
1. A method for forming a light emitting diode (LED) apparatus, the method comprising:
- configuring a metal substrate to have a reflective surface; and
mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other sufficiently to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
5 Assignments
1 Petition
Accused Products
Abstract
An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
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Citations
10 Claims
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1. A method for forming a light emitting diode (LED) apparatus, the method comprising:
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configuring a metal substrate to have a reflective surface; and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other sufficiently to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification