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Efficient LED array

  • US 8,256,929 B2
  • Filed: 12/15/2011
  • Issued: 09/04/2012
  • Est. Priority Date: 09/29/2008
  • Status: Active Grant
First Claim
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1. A method for forming a light emitting diode (LED) apparatus, the method comprising:

  • configuring a metal substrate to have a reflective surface; and

    mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other sufficiently to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

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