Light emitting diode light bar module with electrical connectors formed by injection molding

• US 8,257,110 B2
• Filed: 10/07/2010
• Issued: 09/04/2012
• Est. Priority Date: 10/07/2010
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: TSMC Solid State Lighting Ltd. (Epistar Corporation)
• Inventors: Lee, Hsiao-Wen, Sun, Chih-Hsuan, Yeh, Wei-Yu
• Primary Examiner(s): Duverne, Jean F
• Application Number:
  US12/899,999
• Publication Number:
  US 20120088397A1
• Time in Patent Office: 698 Days
• Field of Search: 439487-488, 297/00, 297/26, 297/49, 257/98, 174/259, 174/98, 361/700, 361/739, 361/748, 361/689
• US Class Current: 439/487
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/14262 Clamping or tensioning means for the insert
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29K 2705/02 Aluminium
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble

Abstract

The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Claims

1. A method of forming an electrical connector of a light emitting diode (LED) light bar comprising:

determining a coefficient of thermal expansion (CTE) of materials of a heat sink, wherein the heat sink has a channel with an opening;

selecting injection molding materials having a CTE that is substantially the same as the CTE of materials of the heat sink;

placing the opening of the channel of the heat sink into an injection mold;

clamping a set of conductor pins into the injection mold at the opening of the channel of the heat sink;

injecting the injection molding materials in molten state into the injection mold to fill cavities between the set of conductor pins and the heat sink;

allowing the injection molding materials to solidify inside the injection mold to form the electrical connector, wherein the electrical connector includes the injection molding materials and the set of conductor pins surrounded radially by the injection molding materials; and

removing the electrical connector and the heat sink from the injection mold.

2. The method of claim 1, wherein the electrical connector comprises a male connector, wherein the mal connector protrudes from the opening of the channel of the heat sink.

3. The method of claim 1, wherein the electrical connector comprises a female connector, wherein the female connector is recessed from the opening of the channel of the heat sink.

4. The method of claim 1, wherein the materials of the heat sink are aluminum 6063, and the injection molding materials are polybutylene terephthalate (PBT) filled with 30% glass fiber.

5. The method of claim 1, wherein said placing the opening of the channel of the heat sink into an injection mold includes positioning the heat sink such that the injection molding materials will contact the channel of the heat sink by a length L1, and wherein said clamping a set of conductor pins into the injection mold includes positioning the set of conductor pins such that the set of conductor pins will be seated in the injection molding materials by a length L2.

6. The method of claim 5, wherein L1=T1/(τ

1×

c1) and L2=T2/(τ

2×

c2), wherein;

T1 is a maximum shear force between the injection molding materials and the heat sink;

τ

1 is a strength of adhesive bonding per unit area between the injection molding materials and the channel of the heat sink;

c1 is a cross sectional perimeter of the channel of the heat sink;

T2 is a maximum shear force between the injection molding materials and the set of conductor pins;

τ

2 is a strength of adhesive bonding per unit area between the injection molding materials and the set of conductor pins; and

c2 is a total radial circumference of the set of conductor pins.

7. The method of claim 5, wherein the electrical connector comprises a male connector, wherein the injection molding materials and the set of conductor pins protrude from the opening of the channel of the heat sink.

8. The method of claim 5, wherein the electrical connector comprises a female connector, wherein an edge of the injection molding materials is coplanar with an edge of the opening of the channel of the heat sink, and the set of conductor pins is recessed from the edge of the opening of the channel of the heat sink.

14. The method of claim 5, wherein L1=T1/(τ

1×

C1) and L2=T2/(τ

2×

c2), wherein;

T1 is a maximum shear force between the injection molding materials and the heat sink;

τ

1 is a strength of adhesive bonding per unit area between the injection molding materials and the channel of the heat sink;

c1 is a cross sectional perimeter of the channel of the heat sink;

T2 is a maximum shear force between the injection molding materials and the set of conductor pins;

τ

2 is a strength of adhesive bonding per unit area between the injection molding materials and the set of conductor pins; and

c2 is a total radial circumference of the set of conductor pins.

9. A method of forming an electrical connector of a light emitting diode (LED) light bar module comprising:

selecting a heat sink, wherein the heat sink has a channel with an opening;

selecting injection molding materials, wherein the injection molding materials are waterproof;

placing the opening of the channel of the heat sink into an injection mold;

clamping a set of conductor pins into the injection mold at the opening of the channel of the heat sink;

injecting the injection molding materials in molten state into the injection mold to fill cavities between the set of conductor pins and the heat sink to form the electrical connector, wherein the electrical connector includes the injection molding materials and the set of conductor pins surrounded radially by the injection molding materials;

forming a waterproof seal between the injection molding materials and the channel of the heat sink by allowing the injection molding materials to solidify; and

removing the electrical connector and the heat sink from the injection mold.

10. The method of claim 9, wherein the electrical connector comprises a male connector, wherein the male connector protrudes from the opening of the channel of the heat sink.

11. The method of claim 9, wherein the electrical connector comprises a female connector, wherein the female connector is recessed from the opening of the channel of the heat sink.

12. The method of claim 9, wherein the materials of the heat sink are aluminum 6063, and the injection molding materials are polybutylene terephthalate (PBT) filled with 30% glass fiber.

13. The method of claim 9, wherein said placing the opening of the channel of the heat sink into an injection mold includes positioning the heat sink such that the injection molding materials will contact the channel of the heat sink by a length L1, and wherein said clamping a set of conductor pins into the injection mold includes positioning the set of conductor pins such that the set of conductor pins will be seated in the injection molding materials by a length L2.

15. The method of claim 13, wherein the electrical connector comprises a male connector, wherein the injection molding materials and the set of conductor pins protrude from the opening of the channel of the heat sink.

16. The method of claim 13, wherein the electrical connector comprises a female connector, wherein an edge of the injection molding materials is coplanar with an edge of the opening of the channel of the heat sink, and the set of conductor pins is recessed from the edge of the opening of the channel of the heat sink.