Systems and methods for affixing a silicon device to a support structure

• US 8,257,119 B2
• Filed: 12/19/2008
• Issued: 09/04/2012
• Est. Priority Date: 12/19/2008
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Foote, Steven A.
• Primary Examiner(s): Duverne, Jean F
• Application Number:
  US12/340,133
• Publication Number:
  US 20100157562A1
• Time in Patent Office: 1,355 Days
• Field of Search: 361/776, 361492-496, 361/76.2
• US Class Current: 439/776
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/3716 Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/40225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

A plurality of ribbon suspenders affix a device to a support structure. Each ribbon suspender is defined by a thickness and a width that is greater than the thickness, and has a first connection portion affixed to the support structure, a second connection portion affixed to the device, and a support portion between the first and second connection portions. The support portion is elastic and flexes to accommodate thermal expansion and contraction of the support structure. A first bond affixes the first connection portion to the support structure and a second bond affixes the second connection portion to the device.

Claims

1. A device support system, comprising:

a ribbon suspender defined by a thickness and a width that is greater than the thickness, the ribbon suspender comprising;

a first connection portion affixed to a support structure;

a second connection portion affixed to a device; and

a support portion between the first and second connection portions,

wherein the portions are formed from a monolithic material;

a first bond affixing the first connection portion to the support structure;

a second bond affixing the second connection portion to the device,

wherein the ribbon suspender is a first ribbon suspender defined by a first thickness and a first width that is greater than the first thickness;

a second ribbon suspender defined by a second thickness and a second width that is greater than the second thickness;

a third ribbon suspender defined by a third thickness and a third width that is greater than the third thickness; and

a fourth ribbon suspender defined by a fourth thickness and a fourth width that is greater than the fourth thickness,

wherein the second ribbon suspender, third ribbon suspender, fourth ribbon suspender are bonded to the device and the support structure with a respective first bond affixing the respective first connection portion to the support structure and with a respective second bond affixing the respective second connection portion to the device,

wherein the device is only connected to the support structure using the ribbon suspender.

2. The device support system of claim 1:

wherein the first ribbon suspender is affixed proximate to a first edge of the device;

wherein the second ribbon suspender is affixed proximate to a second edge of the device that opposes the first edge of the device;

wherein the third ribbon suspender is affixed proximate to a third edge of the device that is adjacent to the first edge of the device; and

wherein the fourth ribbon suspender is affixed proximate to a fourth edge of the device that opposes the third edge of the device.

3. The device support system of claim 2, wherein the widths of the first ribbon suspender, the second ribbon suspender, the third ribbon suspender, and the fourth ribbon suspender are substantially the same.

4. The device support system of claim 3, wherein the first ribbon suspender is aligned with the second ribbon suspender, and wherein the third ribbon suspender is aligned with the fourth ribbon suspender.

5. The device support system of claim 1, wherein the first bond is proximate to a joint between the first connection portion and the support portion, and further comprising:

a third bond affixing the second connection portion to the support structure, wherein the third bond is proximate to an end of the first connection portion.

6. The device support system of claim 1, wherein the ribbon suspender is a gold-plated Kovar ribbon.

7. The device support system of claim 1, wherein the device is a Micro-Electro-Mechanical Systems (MEMS) die.

8. The device support system of claim 1, wherein the support portion is a leadless chip carrier.

9. The device support system of claim 1, wherein the ribbon suspender, the first bond, and the second bond are electrically conductive, wherein the first bond is electrically coupled to a connection of the support structure, and wherein the second bond is electrically coupled to a connection of the device.

10. The device support system of claim 1, wherein the first bond and the second bond are ball bonds.

11. The device support system of claim 1, wherein the first bond and the second bond are gold ball bonds.

12. The device support system of claim 1, wherein the first bond and the second bond are epoxy bonds.

13. The device support system of claim 1, wherein the support portion is elastic in a first direction, and is inelastic in a second direction corresponding to the width of the ribbon suspender.