×

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

  • US 8,258,612 B2
  • Filed: 11/09/2010
  • Issued: 09/04/2012
  • Est. Priority Date: 11/21/2008
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor package system comprising:

  • an encapsulant interposer having a passive device encapsulated, the passive device including a first inductor partially encircled by a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments;

    a first die connected to the encapsulant interposer; and

    a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×