Encapsulant interposer system with integrated passive devices and manufacturing method therefor
First Claim
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1. A semiconductor package system comprising:
- an encapsulant interposer having a passive device encapsulated, the passive device including a first inductor partially encircled by a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments;
a first die connected to the encapsulant interposer; and
a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer.
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Abstract
A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
24 Citations
19 Claims
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1. A semiconductor package system comprising:
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an encapsulant interposer having a passive device encapsulated, the passive device including a first inductor partially encircled by a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments; a first die connected to the encapsulant interposer; and a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing for a semiconductor package system comprising:
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forming a leadframe having a passive device, the passive device including a first inductor partially encircling a second inductor, with the first inductor parallel to the second inductor on at least four sides, and each having at least three corner segments; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer. - View Dependent Claims (11, 12, 13, 14)
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15. A method of manufacturing for a semiconductor package system comprising:
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forming a leadframe having a passive device, the passive device including a first inductor partially encircling a second inductor, with the first inductor parallel to the second inductor on at least four sides and each having at least three corner segments; encapsulating the passive device to form an encapsulant interposer, attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; stacking the encapsulant interposer over the substrate interposer; and encapsulating the encapsulant interposer, the first die, and the second die in a package mold compound. - View Dependent Claims (16, 17, 18, 19)
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Specification