×

High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods

  • US 8,258,682 B2
  • Filed: 02/12/2007
  • Issued: 09/04/2012
  • Est. Priority Date: 02/12/2007
  • Status: Active Grant
First Claim
Patent Images

1. A light emitting apparatus comprising:

  • a substrate;

    a plurality of solid state light emitting elements mounted on a face of the substrate;

    a bar that extends orthogonal to the substrate and is configured to slidably contact an edge of the substrate such that the substrate is slidable along the bar; and

    a housing having an inside and an outside, the housing including an elongated aperture in the housing that is configured to hold the bar in the aperture such that the bar extends from the inside of the housing to the outside of the housing.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×