Light emitting device having a molded body with a specific barycenter

• US 8,258,698 B2
• Filed: 12/16/2010
• Issued: 09/04/2012
• Est. Priority Date: 06/21/2010
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Muranaka, Tetsuya, Nagahata, Yasunori
• Primary Examiner(s): Mai, Anh
• Assistant Examiner(s): Hanley, Britt D
• Application Number:
  US12/969,752
• Publication Number:
  US 20110309736A1
• Time in Patent Office: 628 Days
• Field of Search: None
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.

Claims

1. A light emitting device comprising:

a first lead including a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface;

a light emitting element bonded to a bottom surface of the recess;

a second lead with one end portion opposed to one end portion of the first lead; and

a molded body covering the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and made of a resin, another end portion of the first lead and another end portion of the second lead being projected from the molded body,

a position of barycenter of the molded body being set between a lower surface of the die pad portion on opposite side from the bottom surface of the recess and a plane including an upper end of the bent portion.

2. The device according to claim 1, wherein the position of the barycenter of the molded body is set between the bottom surface of the recess and the major surface of the die pad portion.

3. The device according to claim 1, wherein the second lead includes a bent portion bent toward above a major surface of the second lead.

4. The device according to claim 3, wherein the bent portion of the first lead and the bent portion of the second lead are opened upward and each have a bending angle of 45 degrees or more and 70 degrees or less.

5. The device according to claim 3, wherein the bent portion of the first lead and the bent portion of the second lead have a height of 0.6 mm or more and 1 mm or less.

6. The device according to claim 3, wherein

slits are provided respectively at both ends of a fold of the bent portion of the first lead and both ends of a fold of the bent portion of the second lead, and

the molded body penetrates through the slits.

7. A light emitting device comprising:

a first lead including a die pad portion having a major surface and a recess provided in the major surface, and a first to third bent portions bent toward above the major surface;

a light emitting element bonded to a bottom surface of the recess;

a second lead with one end portion opposed to one end portion of the first lead, the second lead including a bent portion bent toward above a major surface, the bent portion being opposed to one of the first to third bent portions of the first lead; and

a molded body covering the light emitting element, the first to third bent portions, the bent portion of the second lead, and the die pad portion, and made of a resin, another end portion of the first lead and another end portion of the second lead being projected from the molded body,

a position of barycenter of the molded body being set between a lower surface of the die pad portion on opposite side from the bottom surface of the recess and a plane including an upper end of the first to third bent portions.

8. The device according to claim 7, wherein the position of the barycenter of the molded body is set between the bottom surface of the recess and the major surface of the die pad portion.

9. The device according to claim 7, wherein the first to third bent portions of the first lead and the bent portion of the second lead are opened upward and each have a bending angle of 45 degrees or more and 70 degrees or less.

10. The device according to claim 7, wherein the first to third bent portions of the first lead and the bent portion of the second lead have a height of 0.6 mm or more and 1 mm or less.

11. The device according to claim 7, wherein

slits are provided at both ends of a fold of the first to third bent portions of the first lead and both ends of a fold of the bent portion of the second lead, and

the molded body penetrates through the slits.

12. A light emitting device comprising:

a first lead including a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface;

a light emitting element bonded to a bottom surface of the recess;

a second lead with one end portion opposed to one end portion of the first lead; and

a molded body covering the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and made of a resin, another end portion of the first lead and another end portion of the second lead being projected from the molded body, and the molded body including a light emitting surface made of a convex lens or a Fresnel lens,

a position of barycenter of the molded body being set between a lower surface of the die pad portion on opposite side from the bottom surface of the recess and a plane including an upper end of the bent portion.

13. The device according to claim 12, wherein the position of the barycenter of the molded body is set between the bottom surface of the recess and the major surface of the die pad portion.

14. The device according to claim 12, wherein the second lead includes a bent portion bent toward above a major surface of the second lead.

15. The device according to claim 14, wherein

the first lead includes a first to third bent portions, and

the bent portion of the second lead is opposed to one of the first to third bent portions.

16. The device according to claim 15, wherein the first to third bent portions of the first lead and the bent portion of the second lead are opened upward and each have a bending angle of 45 degrees or more and 70 degrees or less.

17. The device according to claim 15, wherein the first to third bent portions of the first lead and the bent portion of the second lead have a height of 0.6 mm or more and 1 mm or less.

18. The device according to claim 14, wherein

slits are provided at both ends of a fold of the first to third bent portions of the first lead and both ends of a fold of the bent portion of the second lead, and

the molded body penetrates through the slits.

19. The device according to claim 12, wherein the upper end of the first to third bent portions lies in the convex lens.

20. The device according to claim 12, wherein a diameter of the convex lens is larger than inner diameter of the plane including the upper end of the first to third bent portion.