×

Submount for electronic components

  • US 8,259,460 B2
  • Filed: 06/05/2007
  • Issued: 09/04/2012
  • Est. Priority Date: 06/08/2006
  • Status: Expired due to Fees
First Claim
Patent Images

1. A submount for arranging electronic components on a substrate, comprising a head member having an upper side and a substrate side and at least one substrate-engaging member protruding from the substrate side of said head member, wherein said head member comprises at least two, from each other isolated, electrically conductive portions, each electrically conductive portion comprising a component contact for connection of electronic components thereto, and a substrate contact arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate;

  • wherein the cross-section of said substrate-engaging member, in a plane perpendicular to the main extension of said substrate engaging member, has an oblong shape.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×