Method for assembling a 3-dimensional microelectrode structure

• US 8,261,428 B2
• Filed: 11/25/2009
• Issued: 09/11/2012
• Est. Priority Date: 11/25/2009
• Status: Active Grant

• Current Assignee: National Tsing Hua University
• Original Assignee: National Tsing Hua University
• Inventors: Fang, Weileun, Chang, Yen-Chung, Lee, Yu-Tao
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US12/626,303
• Publication Number:
  US 20110125001A1
• Time in Patent Office: 1,021 Days
• Field of Search: 295/921, 295/94, 295/95, 296/091, 298/31, 298/46, 735/040.4, 7350412-50416, 310330-332, 310/340, 310/344, 310/345, 600/372, 600/373
• US Class Current: 29/595
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/685 Microneedles
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues.

Claims

1. A method for assembling a 3-dimensional microelectrode structure, comprising the steps of:

Step a;

fabricating 2-dimensional microelectrode arrays, wherein each of said 2-dimensional microelectrode arrays includes a base, a plurality of probes, a plurality of alignment members and a plurality of positioning members, and wherein said probes, said alignment members and said positioning members are connected to said base, and wherein each of said probes has at least one electrode, and wherein said at least one electrode is electrically connected to at least one of the plurality of the alignment members via a corresponding wire;

Step b;

stacking said 2-dimensional microelectrode arrays to form a 3-dimensional microelectrode array, wherein said alignment members of said 2-dimensional microelectrode arrays are neatly arranged at predetermined positions; and

Step c;

assembling said 3-dimensional microelectrode array to a carrier chip to form the 3-dimensional microelectrode structure, wherein said alignment members are electrically connected to a plurality of electric-connection pads of said carrier chip correspondingly.

2. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein each of the plurality of the alignment members has an exposed electric-connection member;

said at least one electrode is connected to corresponding said electric-connection member via the corresponding wire;

in said Step c, said electric-connection members are respectively electrically connected to corresponding said electric-connection pads of said carrier chip.

3. The method for assembling a 3-dimensional microelectrode structure according to claim 2, wherein said carrier chip has a plurality of slots;

in said Step c, said positioning members are accommodated in said slots, whereby said alignment members are aligned to contact said electric-connection pads, and said electric-connection members are electrically connected to said electric-connection pads.

4. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein said 2-dimensional microelectrode arrays are made of a material selected from a group consisting of a glass, PDMS (Polydimethylsiloxane), PI (polyimide), and a thick SU-8 photoresist.

5. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein said at least one electrode is made of a material selected from a group consisting of carbon nanotubes, iridium oxide, platinum, gold, titanium, platinum black, and an electric-conduction polymer PEDOT (polyethylenedioxythiophene).

6. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein said alignment members are a silicon structure.

7. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein said alignment members of different 2-dimensional microelectrode arrays are alternately arranged.

8. The method for assembling a 3-dimensional microelectrode structure according to claim 1, wherein in said Step b, said 2-dimensional microelectrode arrays are stacked to form said 3-dimensional microelectrode array via an auxiliary tool;

said auxiliary tool has a plurality of parallel slots;

said slots accommodate said alignment members and said positioning members and enables said 2-dimensional microelectrode arrays to slide in said auxiliary tool.

9. The method for assembling a 3-dimensional microelectrode structure according to claim 8, wherein in said Step b, an adhesive layer is applied to bond said 2-dimensional microelectrode arrays;

then, pressure is applied to said 2-dimensional microelectrode arrays to form said 3-dimensional microelectrode array.