Surface mounting structure for a surface mounting electronic component
First Claim
1. A surface mounting structure for a surface mounting electronic component, comprising:
- an electronic component having electrodes at opposite ends thereof, the electronic component being a chip component including a chip resistor and a chip capacitor;
a land each of which is connected directly to the respective electrode of the electronic component by soldering;
a wiring connected to the land, the wiring having a width which is smaller than a width of the electronic component in a width direction thereof;
an electrical connection pattern having on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof; and
a metal substrate on which the electronic component is mounted, the metal substrate on which the land, the wiring and the electrical connection pattern is formed,wherein the land includes a restriction portion for the solder to form thereon into a fillet which faces an end face of the electronic component in a direction perpendicular to the longitudinal direction of the electronic component, and which restricts movement of the electronic component in melting the solder, and a projection for the solder to form thereon into a fillet which faces a side face of the electronic component in the longitudinal direction of the electronic component, and the wiring is connected to the land at the projection.
1 Assignment
0 Petitions
Accused Products
Abstract
A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.
15 Citations
14 Claims
-
1. A surface mounting structure for a surface mounting electronic component, comprising:
-
an electronic component having electrodes at opposite ends thereof, the electronic component being a chip component including a chip resistor and a chip capacitor; a land each of which is connected directly to the respective electrode of the electronic component by soldering; a wiring connected to the land, the wiring having a width which is smaller than a width of the electronic component in a width direction thereof; an electrical connection pattern having on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof; and a metal substrate on which the electronic component is mounted, the metal substrate on which the land, the wiring and the electrical connection pattern is formed, wherein the land includes a restriction portion for the solder to form thereon into a fillet which faces an end face of the electronic component in a direction perpendicular to the longitudinal direction of the electronic component, and which restricts movement of the electronic component in melting the solder, and a projection for the solder to form thereon into a fillet which faces a side face of the electronic component in the longitudinal direction of the electronic component, and the wiring is connected to the land at the projection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
Specification