Three dimensional features on light emitting diodes for improved light extraction
First Claim
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1. A light emitting diode comprising:
- at least one light-emitting active layer; and
a patterned semiconductor lenticular surface on the at least one light-emitting active layer, wherein no more than 25 microns of non-lenticular material is provided between the patterned semiconductor lenticular surface and the at least one light-emitting active layer,wherein the patterned semiconductor lenticular surface on the at least one light-emitting active layer is provided by pressing a flexible embossing stamp into a layer of embossable material to provide a pattern therein and etching the semiconductor lenticular surface according to the pattern to provide the patterned semiconductor lenticular surface.
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Abstract
A method is disclosed for obtaining a high-resolution lenticular pattern on the surface of a light emitting diode. The method comprises imprinting a patterned sacrificial layer of etchable material that is positioned on a semiconductor surface that is in turn adjacent a light emitting active region, and thereafter etching the imprinted sacrificial layer and the underlying semiconductor to transfer an imprinted pattern into the semiconductor layer adjacent the light emitting active region.
72 Citations
13 Claims
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1. A light emitting diode comprising:
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at least one light-emitting active layer; and a patterned semiconductor lenticular surface on the at least one light-emitting active layer, wherein no more than 25 microns of non-lenticular material is provided between the patterned semiconductor lenticular surface and the at least one light-emitting active layer, wherein the patterned semiconductor lenticular surface on the at least one light-emitting active layer is provided by pressing a flexible embossing stamp into a layer of embossable material to provide a pattern therein and etching the semiconductor lenticular surface according to the pattern to provide the patterned semiconductor lenticular surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of providing a patterned semiconductor lenticular surface on a surface of a light emitting diode, the method comprising:
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providing a layer of embossable material; heating the layer of embossable material to a temperature sufficient to soften the layer of embossable material but less than a temperature at which the embossable material will flow; pressing a flexible embossing stamp including sub-micron patterns into the heated layer of embossable material to provide a high resolution, sub-micron pattern in the layer of embossable material; and separating the flexible embossing stamp from the layer of embossable material after the layer of embossable material including the high resolution, sub-micron pattern is allowed to cool; wherein providing a layer of embossable material comprises providing a layer of embossable material on a substrate; and wherein separating the flexible embossing stamp from the layer of embossable material is followed by etching the substrate according to the high resolution, sub-micron pattern in the layer of embossable material. - View Dependent Claims (8)
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9. A method of providing a patterned semiconductor lenticular surface on a surface of a light emitting diode, the method comprising:
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providing a substrate; and providing a layer of embossable material on the substrate, the layer of embossable material having an index of refraction closely matched to a material of the substrate, wherein providing the layer of embossable material is followed by; heating the layer of embossable material to a temperature sufficient to soften the layer of embossable material but less than a temperature at which the embossable material will flow; and pressing an embossing stamp into the heated layer of embossable material to provide a pattern in the layer of embossable material; wherein pressing is followed by separating the flexible embossing stamp from the layer of embossable material after the layer of embossable material is allowed to cool; and wherein separating the flexible embossing stamp from the layer of embossable material is followed by etching the substrate according to the pattern in the layer of embossable material. - View Dependent Claims (10, 11, 12, 13)
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Specification