Semiconductor device and manufacturing method of the same

• US 8,264,051 B2
• Filed: 02/28/2011
• Issued: 09/11/2012
• Est. Priority Date: 07/02/2007
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Fujii, Tetsuo, Sugiura, Kazuhiko
• Primary Examiner(s): Roman, Angel
• Application Number:
  US13/036,319
• Publication Number:
  US 20110147863A1
• Time in Patent Office: 561 Days
• Field of Search: 257417-419
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/0616 Random array, i.e. array with no symmetry
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced.

Claims

1. A semiconductor device comprising:

a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element, a peripheral portion, which surrounds the sensor structure, and a connection portion for connecting to an external element; and

a plate-shaped cap element bonded to the surface of the sensor element, wherein;

the cap element has a silicon substrate, a first insulation film on the silicon substrate, a first conduction contact portion and a wiring pattern portion facing the sensor element;

the wiring pattern portion includes;

a first wiring layer disposed on the first insulation film;

a second insulation film disposed on the first wiring layer;

a second wiring layer disposed on the second insulation film; and

a second conduction contact portion;

the first insulation film has a first opening for exposing the silicon substrate via the first opening;

the first conduction contact portion is disposed in the first opening, and electrically connects the silicon substrate and the first wiring layer;

the second wiring layer includes a wiring part, which is disposed on the first wiring layer exposed from the second insulation film, and a hermetically sealing part, which has a ring shape and faces the peripheral portion;

the second insulation film has a second opening so that the first wiring layer is exposed from the second insulation film in the second opening;

the second conduction contact portion is disposed in the second opening;

the second conduction contact portion electrically connects the first wiring layer and the hermetically sealing part so that the silicon substrate is electrically coupled with the peripheral portion via the first conduction contact portion, the first wiring layer, the second conduction contact portion and the hermetically sealing part;

the hermetically sealing part is bonded to the peripheral portion so that the sensor structure is sealed and accommodated in a space defined by the cap element and the sensor element;

the wiring part is coupled with the sensor structure;

the connection portion is disposed on an outside of the space; and

the wiring part is further coupled with the connection portion so that the sensor structure is coupled with the external element via the connection portion and the wiring part.

2. The semiconductor device of claim 1, wherein:

the cap element further includes an IC circuit portion, which is disposed in a surface portion of the cap element and opposite to the sensor element.

3. The semiconductor device of claim 1, wherein:

the cap element further includes an IC circuit portion, which is disposed in a surface portion of the cap element and faces the sensor element.

4. The semiconductor device of claim 1, wherein:

the cap element further includes a recessed part, which faces at least the sensor structure, and is not disposed on the wiring part.

5. The semiconductor device of claim 1 wherein:

the sensor element has an SOI substrate comprising a first silicon layer, a second silicon layer and an insulation layer;

the sensor structure is disposed in the first silicon layer;

the insulation layer is sandwiched between the first silicon layer and the second silicon layer;

the peripheral portion is disposed in the first silicon layer;

the insulation layer has a third opening, in which a substrate contact part is disposed; and

the substrate contact part is disposed between the peripheral portion and the second silicon layer to electrically connect the peripheral portion and the second silicon layer.

6. The semiconductor device of claim 1, wherein:

the sensor element has a third wiring layer on the surface portion of the sensor element; and

the cap element is bonded to the third wiring layer.

7. The semiconductor device of claim 1, wherein:

the sensor structure includes a movable electrode movable within the sensor element;

the first wiring layer faces the movable electrode; and

the sensor element detects distance change between the first wiring layer and the movable electrode so that the sensor element detects a physical quantity in a direction perpendicular to the surface of the sensor element.

8. The semiconductor device of claim 1, wherein:

the sensor structure includes a movable electrode movable within the sensor element;

the wiring pattern portion further includes a counter electrode;

the counter electrode is disposed on the second insulation film, and faces the movable electrode; and

the sensor element detects distance change between the movable electrode and the counter electrode, which corresponds to the distance change between the second wiring layer and the movable electrode.