ESD/antenna diodes for through-silicon vias

• US 8,264,065 B2
• Filed: 10/23/2009
• Issued: 09/11/2012
• Est. Priority Date: 10/23/2009
• Status: Active Grant

• Current Assignee: Synopsys Incorporated
• Original Assignee: Synopsys Incorporated
• Inventors: Su, Qing, Ni, Min, Tang, Zongwu, Kawa, Jamil, Sproch, James D.
• Primary Examiner(s): Soward, Ida M
• Application Number:
  US12/605,102
• Publication Number:
  US 20110095367A1
• Time in Patent Office: 1,054 Days
• Field of Search: 257/700, 257/774, 257/E21.597, 257/E23.011, 257/355, 257/621
• US Class Current: 257/621
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.

Claims

1. An integrated circuit device comprising:

a semiconductor substrate;

a TSV passing through the substrate and having an exclusion zone laterally adjacent thereto;

a transistor having a diffusion region in the substrate, a gate conductor and a gate dielectric separating the gate conductor from the substrate, the diffusion region being disposed outside the exclusion zone;

a first region disposed in the substrate and at least partially within the exclusion zone, the first region being doped to exhibit a first conductivity type, the substrate in at least a second region adjacent to the first region being doped to exhibit a second conductivity type opposite the first conductivity type; and

an M1 layer conductor interconnecting the TSV, the first region, and a member of the group consisting of the diffusion region and the gate conductor.

2. A device according to claim 1, wherein the M1 layer conductor interconnects the TSV, the first region, and the gate conductor.

3. A device according to claim 1, wherein the M1 layer conductor interconnects the TSV, the first region, and the diffusion region.

4. A device according to claim 1, wherein the first region surrounds the TSV laterally.

5. A device according to claim 1, wherein the first conductivity type is N and the second conductivity type is P.

6. A device according to claim 1, wherein the first region is disposed entirely within the exclusion zone.

7. An integrated circuit device comprising:

a semiconductor substrate;

a TSV passing through the substrate;

a transistor having a diffusion region in the substrate, a gate conductor and a gate dielectric separating the gate conductor from the substrate, the diffusion region being disposed entirely beyond 0.5 microns from the TSV;

a first region disposed in the substrate and at least partially within 0.5 micron from the TSV, the first region being doped to exhibit a first conductivity type, the substrate in at least a second region adjacent to the first region being doped to exhibit a second conductivity type opposite the first conductivity type; and

an M1 layer conductor interconnecting the TSV, the first region, and a member of the group consisting of the diffusion region and the gate conductor.

8. A device according to claim 7, wherein the M1 layer conductor interconnects the TSV, the first region, and the gate conductor.

9. A device according to claim 7, wherein the M1 layer conductor interconnects the TSV, the first region, and the diffusion region.

10. A device according to claim 7, wherein the first region surrounds the TSV laterally.

11. A device according to claim 7, wherein the first conductivity type is N and the second conductivity type is P.

12. A device according to claim 7, wherein the first region is disposed entirely within 0.5 micron from the TSV.

13. An integrated circuit device comprising:

a semiconductor substrate;

a TSV passing through the substrate;

a transistor having a diffusion region, a gate conductor and a gate dielectric separating the gate conductor from the substrate, the diffusion region being disposed in the substrate;

a first region disposed in the substrate and surrounding the TSV laterally, the first region being doped to exhibit a first conductivity type, the substrate in at least a second region adjacent to the first region being doped to exhibit a second conductivity type opposite the first conductivity type; and

an M1 layer conductor interconnecting the TSV, the first region, and a member of the group consisting of the diffusion region and the gate conductor.

14. A device according to claim 13, wherein the M1 layer conductor interconnects the TSV, the first region, and the gate conductor.

15. A device according to claim 13, wherein the M1 layer conductor interconnects the TSV, the first region, and the diffusion region.

16. A device according to claim 13, wherein the first conductivity type is N and the second conductivity type is P.

17. A device according to claim 13, wherein the TSV has an associated exclusion zone,

and wherein the first region is disposed entirely with the exclusion zone.

18. An integrated circuit device comprising:

a semiconductor substrate;

a TSV passing through the substrate;

a plurality of transistors on the substrate, each having first and second diffusion regions, a gate dielectric and a gate conductor overlying the gate dielectric, the plurality of transistors including a particular transistor having a particular diffusion region, a particular gate dielectric and a particular gate conductor overlying the particular gate dielectric;

a subject region distinct from all the diffusion regions of all the transistors on the substrate, the subject region being doped to exhibit a first conductivity type, the substrate in at least a second region adjacent to the subject region being doped to exhibit a second conductivity type opposite the first conductivity type; and

an M1 layer conductor interconnecting the TSV, the subject region, and a member of the group consisting of the particular diffusion region and the gate conductor,

wherein the point of the subject region which is nearest the TSV is closer to the TSV than the nearest point to the TSV of the diffusion regions of all of the transistors on the substrate.

19. A device according to claim 18, wherein the entire subject region is closer to the TSV than the nearest point to the TSV of the diffusion regions of all of the transistors on the substrate.

20. A device according to claim 18, wherein the M1 layer conductor interconnects the TSV, the subject region, and the gate conductor.

21. A device according to claim 18, wherein the M1 layer conductor interconnects the TSV, the subject region, and the diffusion region.

22. A device according to claim 18, wherein the subject region surrounds the TSV laterally.

23. A device according to claim 22, wherein the subject region is disposed at least partly within 0.5 microns from the TSV.

24. A device according to claim 22, wherein the TSV has an associated exclusion zone,

and wherein the subject region is disposed at least partly within the exclusion zone.

25. A device according to claim 24, further comprising:

a plurality of antenna diodes in the substrate, each connected to one or more of the gate conductors of transistors in the plurality of transistors, each antenna diode in the substrate occupying a respective lateral area in the substrate;

wherein the subject region occupies a lateral area which is larger than the average area occupied laterally by each antenna diode in the substrate which is not connected to a TSV.

26. A device according to claim 25, wherein the subject region occupies a lateral area which is larger than the area occupied laterally by each antenna diode in the substrate which is not connected to a TSV.

27. A device according to claim 18, wherein the first conductivity type is N and the second conductivity type is P.

28. An integrated circuit device comprising:

a semiconductor substrate;

a TSV passing through the substrate;

a plurality of transistors in the substrate, each having a gate terminal;

a plurality of antenna diodes in the substrate, each connected to one or more of the gate terminals of transistors in the plurality, each antenna diode in the substrate occupying a respective lateral area in the substrate;

an M1 layer conductor interconnecting the TSV, a particular one of the gate conductors, and a particular one of the antenna diodes,

wherein the particular antenna diode occupies a lateral area which is larger than the average area occupied laterally by all antenna diodes in the substrate which are not connected to a TSV.

29. A device according to claim 28, wherein the particular antenna diode occupies a lateral area which is larger than the area occupied laterally by each antenna diode in the substrate which is not connected to a TSV.

30. A device according to claim 28, wherein the TSV is one of a plurality of TSVs passing through the substrate,

comprising a respective M1 layer conductor interconnecting a respective one of the TSVs, a respective one of the gate conductors, and a respective one of the antenna diodes,

and wherein each of the antenna diodes in the substrate which is connected to a TSV occupies a lateral area which is larger than the average area occupied laterally by all antenna diodes in the substrate which are not connected to a TSV.

31. A device according to claim 30, wherein each of the antenna diodes in the substrate which is connected to a TSV occupies a lateral area which is larger than the area occupied laterally by each antenna diode in the substrate which is not connected to a TSV.

32. A device according to claim 28, wherein the particular antenna diode surrounds the TSV laterally.

33. A device according to claim 28, wherein the TSV has an associated exclusion zone,

and wherein the particular antenna diode is disposed entirely within the exclusion zone.