Half-duplex, single-fiber (S-F) optical transceiver module and method

• US 8,265,487 B2
• Filed: 07/29/2009
• Issued: 09/11/2012
• Est. Priority Date: 07/29/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies Fiber IP Singapore PTE Limited (Broadcom, Inc.)
• Inventors: Schunk, Nikolaus W.
• Primary Examiner(s): Bello, Agustin
• Application Number:
  US12/511,262
• Publication Number:
  US 20110026919A1
• Time in Patent Office: 1,140 Days
• Field of Search: 398135-139, 385 88- 94
• US Class Current: 398/139
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H04B 10/40 Transceivers

Abstract

A half-duplex, single-fiber (S-F) optical transceiver module is provided in which a light source, such as a laser diode or a light-emitting diode (LED), is mounted on an edge region of a photodiode to increase the amount of surface area of the photodiode that is available for absorbing light received in the optical transceiver module. The S-F optical transceiver module has a relatively simple optical coupling system for coupling light between an end face of an optical fiber and the photodiode and laser diode or LED with high optical coupling efficiency and reduced optical crosstalk.

Claims

1. A half-duplex, single-fiber (S-F) optical transceiver module for communication over an optical link, the S-F optical transceiver module comprising:

a leadframe having at least a first leadframe portion, a second leadframe portion, and a plurality of electrically conductive leads, the first leadframe portion having an upper surface and a lower surface, the second leadframe portion having an upper surface and a lower surface;

a photodiode having a cathode, an anode, an upper light-receiving surface, and a lower mounting surface, the photodiode being disposed on the upper surface of the first leadframe portion such that the lower mounting surface of the photodiode is adjacent the upper surface of the first leadframe portion;

a light source having a cathode, an anode, an upper light-emitting surface, and a lower mounting surface, the light source being disposed on an edge region of the upper light-receiving surface of the photodiode such that the lower mounting surface of the light source is adjacent the upper light-receiving surface of the photodiode in the edge region of the upper light-receiving surface;

a transparent molded encapsulation that encapsulates the photodiode, the light source, and a portion of the leadframe that includes at least the first and second leadframe portions; and

an optical coupling system integrally formed in the transparent molded encapsulation, the optical coupling system including at least a lens portion and an alignment portion, the alignment portion being configured to provide at least one surface that abuts a first end face of an optical fiber when the first end face of the optical fiber is attached to the optical coupling system, and wherein the lens portion is configured to optically couple light passing out of the first end face of the optical fiber onto the upper light-receiving surface of the photodiode and to optically couple light emitted from the upper light-emitting surface of the light source onto the end face of the optical fiber and into a core of the optical fiber, and wherein the mounting of the light source on the edge region of the upper light-receiving surface of the photodiode ensures that the light source prevents only a very small portion of the light passing out of the first end face from being optically coupled by the lens portion onto the upper light-receiving surface of the photodiode, and wherein the first leadframe portion is tilted with respect to the second leadframe portion such that an optical axis of the light source is tilted at a non-zero tilt angle with respect to an optical axis of the optical fiber, the non-zero tilt angle being greater than 0 degrees and less than 90 degrees, and wherein the tilt of the optical axis of the light source with respect to the optical axis of the optical fiber ensures that light emitted from the light source is optically coupled efficiently into the core of the optical fiber.

2. The half-duplex, S-P optical transceiver module of claim 1, wherein the light source is a light-emitting diode (LED).

3. The half-duplex, S-P optical transceiver module of claim 1, wherein the light source is a vertical cavity surface emitting laser diode (VCSEL).

4. The half-duplex, S-F optical transceiver module of claim 1, wherein the non-zero tilt angle is selected from a range of angles ranging between about 5 degrees and about 20 degrees.

5. The half-duplex, S-F optical transceiver module of claim 1, further comprising:

a transceiver integrated circuit (IC) mounted on the upper surface of the second portion of the leadframe; and

electrically conductive bond wires having first ends connected to electrical contact pads of the transceiver IC and second ends connected to either the cathodes or anodes of the photodiode and the light source.

17. The method of claim 1, wherein the third portion of the leadframe comprising the electrically conductive leads is bent at a location on the leadframe between the encapsulated portion of the leadframe and the leads such that each of the leads is at a non-zero angle with respect to the plane in which the leadframe lies.

18. The method of claim 17, further comprising:

providing a header that encapsulates all of the S-F optical transceiver module except for respective ends of the respective electrically conductive leads, and wherein the respective ends of the respective electrically conductive leads extend through a first side edge of the header in a direction that is generally perpendicular to the first side edge of the header.

6. A method for optically coupling optical signals between a half-duplex, single-fiber (S-F) optical transceiver module and a first end face of a single optical fiber attached to the S-F optical transceiver module, the method comprising:

providing an S-F optical transceiver module having a leadframe, a photodiode, a light source, and a transparent molded encapsulation having an optical coupling system integrally formed therein, the leadframe having at least a first leadframe portion, a second leadframe portion, and a plurality of electrically conductive leads, the first and second leadframe portions each having an upper surface and a lower surface, the photodiode having a cathode, an anode, an upper light-receiving surface, and a lower mounting surface, the photodiode being disposed on the upper surface of the first leadframe portion such that the lower mounting surface of the photodiode is adjacent the upper surface of the first leadframe portion, the light source having a cathode, an anode, an upper light-emitting surface, and a lower mounting surface, the light source being disposed on an edge region of the upper light-receiving surface of the photodiode such that the lower mounting surface of the light source is adjacent the upper light-receiving surface of the photodiode in the edge region of the upper light-receiving surface, the transparent molded encapsulation encapsulating the photodiode, the light source, and a portion of the leadframe that includes at least the first and second leadframe portions, and wherein the first leadframe portion is tilted with respect to the second leadframe portion such that an optical axis of the light source is tilted at a non-zero tilt angle with respect to an optical axis of the optical fiber, the non-zero tilt angle being greater than 0 degrees and less than 90 degrees;

with a lens portion of the optical coupling system, optically coupling light passing out of the first end face of the optical fiber onto the upper light-receiving surface of the photodiode and optically coupling light emitted by the upper light-emitting surface of the light source onto the first end face of the optical fiber, and wherein the mounting of the light source on the edge region of the upper light-receiving surface of the photodiode ensures that the light source prevents only a very small portion of the light passing out of the first end face from being optically coupled by the lens portion onto the upper light-receiving surface of the photodiode, and wherein the tilt of the optical axis of the light source with respect to the optical axis of the optical fiber ensures that light emitted from the light source is optically coupled efficiently into the core of the optical fiber.

7. The method of claim 6, wherein the light source is a light-emitting diode (LED).

8. The method of claim 6, wherein the light source is a vertical cavity surface emitting laser diode (VCSEL).

9. The method of claim 6, wherein the tilt angle is selected from a range of angles ranging between about 5 degrees and about 20 degrees.

10. The method of claim 6, wherein the leadframe has a transceiver integrated circuit (IC) mounted on the upper surface of the second portion of the leadframe, and wherein electrically conductive bond wires are connected on first ends of the bond wires to electrical contact pads of the transceiver IC and on second ends of the bond wires to either the cathodes or anodes of the photodiode and the light source.

11. A half-duplex, single-fiber (S-F) optical transceiver module for communication over an optical link, the S-F optical transceiver module comprising:

a leadframe having at least a first leadframe portion, a second leadframe portion, a third leadframe portion, the third leadframe portion comprising a plurality of electrically conductive leads, the first leadframe portion having an upper surface and a lower surface, the second leadframe portion having an upper surface and a lower surface that are generally parallel to and coplanar with an upper surface and a lower surface, respectively, of the first leadframe portion;

a photodiode having a cathode, an anode, an upper light-receiving surface, and a lower mounting surface, the photodiode being disposed on the upper surface of the first leadframe portion such that the lower mounting surface of the photodiode is adjacent the upper surface of the first leadframe portion;

a light source having a cathode, an anode, an upper light-emitting surface, and a lower mounting surface, the light source being disposed on an edge region of the upper light-receiving surface of the photodiode such that the lower mounting surface of the light source is adjacent the upper light-receiving surface of the photodiode in the edge region of the upper light-receiving surface;

a transparent molded encapsulation that encapsulates the photodiode, the light source, and a portion of the leadframe that includes at least the first and second leadframe portions; and

an optical coupling system integrally formed in the transparent molded encapsulation, the optical coupling system including at least a lens portion and an alignment portion, the alignment portion being configured to provide at least one surface that abuts a first end face of an optical fiber when the first end face of the optical fiber is attached to the optical coupling system, and wherein the lens portion is configured to optically couple light passing out of the first end face of the optical fiber onto the upper light-receiving surface of the photodiode and to optically couple light emitted from the upper light-emitting surface of the light source onto the end face of the optical fiber and into a core of the optical fiber, and wherein a third portion of the leadframe comprising the electrically conductive leads is not encapsulated in the transparent molded encapsulation, and wherein the encapsulated portion of the leadframe is tilted within the transparent molded encapsulation such that if an end face of an optical fiber is attached to the optical coupling system, an optical axis of the light source is at a non-zero tilt angle with respect to an optical axis of the optical fiber, the non-zero tilt angle being greater than 0 degrees and less than 90 degrees, and wherein the non-zero tilt angle of the optical axis of the light source with respect to the optical axis of the optical fiber ensures that light emitted from the light source is optically coupled efficiently into the core of the optical fiber.

12. The half-duplex, S-F optical transceiver module of claim 11, wherein the non-zero tilt angle is selected from a range of angles ranging between about 5 degrees and about 20 degrees.

13. The half-duplex, S-F optical transceiver module of claim 12, wherein the third portion of the leadframe comprising the electrically conductive leads is bent at a location on the leadframe between the encapsulated portion of the leadframe and the leads such that each of the leads is at a non-zero angle with respect to the plane in which the leadframe lies.

14. The half-duplex, S-F optical transceiver module of claim 13, further comprising:

a header, the header encapsulating all of the S-F optical transceiver module except for respective ends of the respective electrically conductive leads, and wherein the respective ends of the respective electrically conductive leads extend through a first side edge of the header in a direction that is generally perpendicular to the first side edge of the header.

15. A method for optically coupling optical signals between a half-duplex, single-fiber (S-F) optical transceiver module and a first end face of a single optical fiber attached to the S-F optical transceiver module, the method comprising:

providing an S-F optical transceiver module having a leadframe, a photodiode, a light source, and a transparent molded encapsulation having an optical coupling system integrally formed therein, the leadframe having at least a first leadframe portion, a second leadframe portion, and a third leadframe portion, the first and second leadframe portions each having an upper surface and a lower surface, the third leadframe portion comprising a plurality of electrically conductive leads, the photodiode having a cathode, an anode, an upper light-receiving surface, and a lower mounting surface, the photodiode being disposed on the upper surface of the first leadframe portion such that the lower mounting surface of the photodiode is adjacent the upper surface of the first leadframe portion, the light source having a cathode, an anode, an upper light-emitting surface, and a lower mounting surface, the light source being disposed on an edge region of the upper light-receiving surface of the photodiode such that the lower mounting surface of the light source is adjacent the upper light-receiving surface of the photodiode in the edge region of the upper light-receiving surface, the transparent molded encapsulation encapsulating the photodiode, the light source, and a portion of the leadframe that includes at least the first and second leadframe portions, and wherein the encapsulated portion of the leadframe is tilted within the transparent molded encapsulation such that an optical axis of the light source is at a non-zero tilt angle with respect to an optical axis of an optical fiber that is attached on an end face of the optical fiber to the optical coupling system, the non-zero tilt angle being greater than 0 degrees and less than 90 degrees; and

with a lens portion of the optical coupling system, optically coupling light passing out of the first end face of the optical fiber onto the upper light-receiving surface of the photodiode and optically coupling light emitted by the upper light-emitting surface of the light source onto the first end face of the optical fiber, and wherein the non-zero tilt angle of the optical axis of the light source with respect to the optical axis of the optical fiber ensures that light emitted from the light source is optically coupled efficiently into the core of the optical fiber.

16. The method of claim 15, wherein the non-zero tilt angle is selected from a range of angles ranging between about 5 degrees and about 20 degrees.