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Module having a stacked magnetic device and semiconductor device and method of forming the same

  • US 8,266,793 B2
  • Filed: 02/26/2009
  • Issued: 09/18/2012
  • Est. Priority Date: 10/02/2008
  • Status: Active Grant
First Claim
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1. A method of forming a stacked module having a magnetic core and a semiconductor device, comprising:

  • providing a printed wiring board;

    forming a patterned conductor on an upper surface of said printed wiring board;

    mounting a magnetic core having a relatively high magnetic permeability on said upper surface of said printed wiring board proximate said patterned conductor; and

    mounting a semiconductor device directly above an upper surface of said magnetic core.

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