Module having a stacked magnetic device and semiconductor device and method of forming the same

• US 8,266,793 B2
• Filed: 02/26/2009
• Issued: 09/18/2012
• Est. Priority Date: 10/02/2008
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Enpirion, Inc. (Intel Corporation)
• Inventors: Lotfi, Ashraf W., Lopata, Douglas Dean, Weld, John David, Wilkowski, Mathew A.
• Primary Examiner(s): ANGWIN, DAVID PATRICK
• Application Number:
  US12/393,835
• Publication Number:
  US 20100212150A1
• Time in Patent Office: 1,300 Days
• Field of Search: 298/32, 298/31, 298/34, 298/41, 298/46, 298/54, 298/55, 174/255, 257/335, 257/336, 257/528, 257/686, 336/90
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48799 Principal constituent of the connecting portion of the wire connector being Copper (Cu)
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/086 : for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Claims

1. A method of forming a stacked module having a magnetic core and a semiconductor device, comprising:

providing a printed wiring board;

forming a patterned conductor on an upper surface of said printed wiring board;

mounting a magnetic core having a relatively high magnetic permeability on said upper surface of said printed wiring board proximate said patterned conductor; and

mounting a semiconductor device directly above an upper surface of said magnetic core.

2. The method as recited in claim 1 wherein said patterned conductor is a spirally shaped conductor.

3. The method as recited in claim 1 further comprising forming upper conductive lands around a periphery of said upper surface of said printed wiring board and lower conductive lands around a periphery of a lower surface of said printed wiring board, wherein ones of said lower conductive lands form external terminals for said module.

4. The method as recited in claim 1 further comprising forming an upper conductive land on said upper surface of said printed wiring board coupled by an electrically conductive via to a lower conductive land formed on a lower surface of said printed wiring board.

5. The method as recited in claim 1 wherein a terminal of said patterned conductor terminates on an upper conductive land formed on said upper surface of said printed wiring board and another terminal of said patterned conductor is coupled by an electrically conductive via to a terminal of another patterned conductor formed on a lower surface of said printed wiring board.

6. The method as recited in claim 5 wherein another terminal of said another patterned conductor terminates on a lower conductive land formed on said lower surface of said printed wiring board.

7. The method as recited in claim 6 further comprising depositing an insulating material on said lower surface of said printed wiring board over said another patterned conductor and said electrically conductive via.

8. The method as recited in claim 1 wherein said patterned conductor is formed with a layer of copper overlaid with a thin film of gold.

9. The method as recited in claim 1 wherein mounting said magnetic core includes depositing epoxy dots on said upper surface of said printed wiring board, pressing said magnetic core on to said epoxy dots and then curing said epoxy dots.

10. The method as recited in claim 1 further comprising forming said magnetic core by depositing a magnetic material on to a non-electrically conductive carrier in a molded package.

11. The method as recited in claim 10 wherein said non-electrically conductive carrier is a substantially undoped silicon die.

12. The method as recited in claim 1 further comprising forming said magnetic core by depositing a seed layer of a conductive material on to a non-electrically conductive carrier and a magnetic thin-film material on to said seed layer in a molded package.

13. The method as recited in claim 12 wherein said magnetic thin-film material includes a metallic alloy.

14. The method as recited in claim 13 wherein said metallic alloy includes ones of iron, cobalt, and nickel.

15. The method as recited in claim 1 wherein said magnetic core is formed with a relatively high magnetic permeability material operative to produce a magnetic minor effect wherein a substantial portion of a magnetic flux produced in accordance with said patterned conductor is conducted within a volume of said magnetic core.

16. The method as recited in claim 1 further comprising forming said magnetic core as a ceramic ferrite piece part in a molded package.

17. The method as recited in claim 1 further comprising coupling a pad formed on an upper surface of said semiconductor device with a wire bond to an upper conductive land formed on said upper surface of said printed wiring board.

18. The method as recited in claim 1 wherein mounting said semiconductor device includes depositing epoxy dots on said upper surface of said magnetic core, pressing said semiconductor device on to said epoxy dots and then curing said epoxy dots.

19. The method as recited in claim 1 wherein said module is a power module and said semiconductor device includes at least one switch and a controller therefor.

20. The method as recited in claim 1 further comprising encapsulating portions of said printed wiring board, said magnetic core and said semiconductor device with an encapsulant.