Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins

• US 8,266,802 B2
• Filed: 06/18/2008
• Issued: 09/18/2012
• Est. Priority Date: 06/18/2008
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Campbell, Levi A., Chu, Richard C., Ellsworth, Michael J. Jr., Iyengar, Madhusudan K., Schmidt, Roger R., Simons, Robert E.
• Primary Examiner(s): Duong, Tho V
• Application Number:
  US12/141,290
• Publication Number:
  US 20090314467A1
• Time in Patent Office: 1,553 Days
• Field of Search: 298/900.3, 298/900.5, 298/900.35, 165/80.3, 165/80.4, 165/185, 165/908, 361/695, 361/697, 361/699
• US Class Current: 29/890.03
• CPC Class Codes: F28F 13/02 by influencing fluid boundary boundary-layer control in general F15D
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.

Claims

1. A method comprising:

providing a plurality of thermally conductive pin fins extending from a surface to be cooled to facilitate transfer of heat therefrom, each pin fin of the plurality of thermally conductive pin fins comprising a stem with a bulb structure adjacent to a distal end thereof;

depositing material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a jet impingement structure integral therewith, wherein the bulb structures at the distal ends of the plurality of thermally conductive pin fins integrally form part of the jet impingement structure; and

controlling the depositing of material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a plurality of jet orifices in the jet impingement structure, wherein the depositing results in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.

2. The method of claim 1, wherein each pin fin of the plurality of thermally conductive pin fins is similarly sized and comprises a stem with a cross-sectional diameter smaller than a cross-sectional diameter of the bulb structure at the distal end thereof.

3. The method of claim 1, wherein the controlling comprises continuing with depositing of material onto the distal ends of the plurality of thermally conductive pin fins until the deposited material on the distal ends of the thermally conductive pin fins physically contacts and the plurality of jet orifices are achieved, wherein each jet orifice of the plurality of jet orifices is disposed in the jet impingement structure between four thermally conductive pin fins extending from the surface to be cooled.

4. The method of claim 1, wherein the providing comprises providing gold or copper pin fins for the plurality of thermally conductive pin fins, and wherein the depositing comprises one of electroplating metal onto the gold or copper pin fins, or depositing diamond or metal onto the plurality of thermally conductive pin fins.

5. The method of claim 1, wherein the providing comprises wire-bonding the plurality of thermally conductive pin fins to the surface to be cooled, wherein the surface to be cooled comprises a thermally conductive base plate or a portion of an electronic device to be cooled, the electronic device comprising at least one of an integrated circuit chip, multiple integrated circuit chips, a single chip module or a multichip module.

6. A cooling apparatus comprising:

a liquid coolant supply comprising a jet impingement structure, the jet impingement structure comprising a plurality of jet orifices for directing liquid coolant onto a surface to be cooled; and

wherein the jet impingement structure further comprises a plurality of thermally conductive pin fins extending therefrom towards the surface to be cooled to facilitate transfer of heat from the surface to be cooled, and wherein the jet impingement structure with the plurality of thermally conductive pin fins extending therefrom is a single, monolithic structure.

7. The cooling apparatus of claim 6, wherein the plurality of jet orifices of the jet impingement structure are self-aligned within the single, monolithic structure between the plurality of thermally conductive pin fins extending therefrom.

8. The cooling apparatus of claim 6, wherein the jet impingement structure is formed integral with the plurality of thermally conductive pin fins using electroplating or deposition of material onto bulb structures of the plurality of thermally conductive pin fins, wherein the bulb structures of the plurality of thermally conductive pin fins integrally form part of the jet impingement structure.

9. The cooling apparatus of claim 6, wherein the plurality of thermally conductive pin fins are wire-bonded to the surface to be cooled, and each pin fin comprises a stem with a bulb structure at each end, wherein the bulb structures at one end of the stems are integrated with the jet impingement structure, and the bulb structures at the other end of the stems facilitate bonding the stems to the surface to be cooled.

10. The cooling apparatus of claim 6, wherein the jet impingement structure and the plurality of thermally conductive pin fins extending therefrom each comprise a same material on an outer portion thereof, the same material defining the single, monolithic structure.

11. The cooling apparatus of claim 6, wherein the plurality of jet orifices are each diamond-shaped in cross-section with a concave curvature to at least one side of a surface thereof forming the diamond-shaped opening.

12. The cooling apparatus of claim 6, wherein the plurality of thermally conductive pin fins extend from the jet impingement structure in a uniform array, and wherein the plurality of jet orifices are aligned in a uniform array between the plurality of thermally conductive pin fins, and each jet orifice of the plurality of jet orifices is an opening with a non-circular cross-section.

13. The cooling apparatus of claim 6, wherein each pin fin of the plurality of thermally conductive pin fins is a discrete pin fin separately diffusion weld-bonded to and thermally merged with the surface to be cooled, and wherein the surface to be cooled comprises a portion of an electronic device to be cooled, the electronic device comprising at least one of an integrated circuit chip, multiple integrated circuit chips, or a single chip module or a multichip module.

14. The cooling apparatus of claim 13, wherein the electronic device to be cooled resides on a substrate, and wherein the cooling apparatus further comprises a housing sealably engaging the substrate to define a liquid coolant flow path within which the plurality of thermally conductive pin fins extend, wherein heat is transferred in part from the surface to be cooled of the electronic device through the plurality of thermally conductive pin fins to liquid coolant within the liquid coolant flow path when the cooling apparatus is employed to cool the electronic device.

15. A cooled electronic module comprising:

a substrate and at least one heat-generating electronic device attached thereto; and

a cooling apparatus for cooling the at least one heat-generating electronic device, the cooling apparatus comprising;

a liquid coolant supply comprising a jet impingement structure, the jet impingement structure comprising a plurality of jet orifices for directing liquid coolant onto a surface to be cooled, the surface to be cooled being thermally coupled to the at least one heat-generating electronic device; and

wherein the jet impingement structure further comprises a plurality of thermally conductive pin fins extending therefrom towards the surface to be cooled to facilitate transfer of heat from the surface to be cooled, and wherein the jet impingement structure with the plurality of thermally conductive pin fins extending therefrom is a single, monolithic structure.

16. The cooled electronic module of claim 15, wherein the plurality of jet orifices of the jet impingement structure of the cooling apparatus are self-aligned within the single, monolithic structure between the plurality of thermally conductive pin fins extending therefrom.

17. The cooled electronic module of claim 15, wherein the plurality of thermally conductive pin fins of the cooling apparatus are wire-bonded to the surface to be cooled, and each pin fin comprises a stem with a bulb structure at each end, wherein the bulb structures at one end of the stems are integrated within the jet impingement structure, and the bulb structures at the other end of the stems facilitate bonding the stems to the surface to be cooled.

18. The cooled electronic module of claim 15, wherein the jet impingement structure and the plurality of thermally conductive pin fins extending therefrom each comprise a same material on an outer portion thereof, the same material defining the single, monolithic structure.

19. The cooled electronic module of claim 15, wherein the plurality of jet orifices of the jet impingement structure of the cooling apparatus are each diamond-shaped in cross-section, and comprise a concave curvature to at least one side surface thereof forming the diamond-shaped opening.

20. The cooled electronic module of claim 15, wherein the plurality of thermally conductive pin fins of the cooling apparatus extend from the jet impingement structure in a uniform array, and wherein the plurality of jet orifices are aligned in a uniform array between the plurality of thermally conductive pin fins, and each jet orifice of the plurality of jet orifices is an opening with a non-circular cross-section.