Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins
First Claim
1. A method comprising:
- providing a plurality of thermally conductive pin fins extending from a surface to be cooled to facilitate transfer of heat therefrom, each pin fin of the plurality of thermally conductive pin fins comprising a stem with a bulb structure adjacent to a distal end thereof;
depositing material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a jet impingement structure integral therewith, wherein the bulb structures at the distal ends of the plurality of thermally conductive pin fins integrally form part of the jet impingement structure; and
controlling the depositing of material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a plurality of jet orifices in the jet impingement structure, wherein the depositing results in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.
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Accused Products
Abstract
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.
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Citations
20 Claims
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1. A method comprising:
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providing a plurality of thermally conductive pin fins extending from a surface to be cooled to facilitate transfer of heat therefrom, each pin fin of the plurality of thermally conductive pin fins comprising a stem with a bulb structure adjacent to a distal end thereof; depositing material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a jet impingement structure integral therewith, wherein the bulb structures at the distal ends of the plurality of thermally conductive pin fins integrally form part of the jet impingement structure; and controlling the depositing of material onto the bulb structures at the distal ends of the plurality of thermally conductive pin fins to form a plurality of jet orifices in the jet impingement structure, wherein the depositing results in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins. - View Dependent Claims (2, 3, 4, 5)
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6. A cooling apparatus comprising:
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a liquid coolant supply comprising a jet impingement structure, the jet impingement structure comprising a plurality of jet orifices for directing liquid coolant onto a surface to be cooled; and wherein the jet impingement structure further comprises a plurality of thermally conductive pin fins extending therefrom towards the surface to be cooled to facilitate transfer of heat from the surface to be cooled, and wherein the jet impingement structure with the plurality of thermally conductive pin fins extending therefrom is a single, monolithic structure. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. A cooled electronic module comprising:
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a substrate and at least one heat-generating electronic device attached thereto; and a cooling apparatus for cooling the at least one heat-generating electronic device, the cooling apparatus comprising; a liquid coolant supply comprising a jet impingement structure, the jet impingement structure comprising a plurality of jet orifices for directing liquid coolant onto a surface to be cooled, the surface to be cooled being thermally coupled to the at least one heat-generating electronic device; and wherein the jet impingement structure further comprises a plurality of thermally conductive pin fins extending therefrom towards the surface to be cooled to facilitate transfer of heat from the surface to be cooled, and wherein the jet impingement structure with the plurality of thermally conductive pin fins extending therefrom is a single, monolithic structure. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification