Assembly of silicon parts bonded together with a silicon and silica composite

• US 8,268,448 B2
• Filed: 01/11/2010
• Issued: 09/18/2012
• Est. Priority Date: 04/23/2003
• Status: Expired due to Term

• Current Assignee: Hangzhou Dunyuanjuxin Semiconductor Technology Company Limited
• Original Assignee: Ferrotec Corporation (Ferrotec Holdings Corporation)
• Inventors: Boyle, James E., Zehavi, Raanan, Chalzel, Amnon
• Primary Examiner(s): LANGMAN, JONATHAN C
• Application Number:
  US12/685,542
• Publication Number:
  US 20100119817A1
• Time in Patent Office: 981 Days
• Field of Search: 427/372.2, 427/397.7, 428/323, 428/332, 428/428, 428/446, 428/448, 156/89.11
• US Class Current: 428/446
• CPC Class Codes: H01L 21/67306 characterized by a material, a roughness, a coating or the like
• CPC Class Codes: Y10T 428/24174 including sheet or component perpendicular to plane of web or sheet
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/252 Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size maybe formed by CVD. Larger particles maybe milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.

Claims

1. A joined silicon assembly, comprising:

at least two silicon-based parts juxtaposed across respective pairs of joining areas separated by a respective gap of about 50 μ

m or more; and

a composite bridging interior portions of the gap, adhering the at least two silicon-based parts together, and comprising a plurality of silicon crystallites having at least interiors consisting essentially of silicon and embedded in a matrix of silica, where the parts are capable of being free standing when not adhered together by the composite;

wherein the diameter of the plurality of silicon crystallites is less than the size of the respective gap.

2. The assembly of claim 1, wherein the plurality of silicon crystallites have sizes of less than 100 μ

m.

3. The assembly of claim 1, wherein the plurality of silicon crystallites have a size distribution with at least 99% of particles of size of less than 100 nm.

4. The assembly of claim 1 configured as a support fixture for supporting a plurality of substrates in parallel orientations spaced along an axis of the fixture.

5. The assembly of claim 1, wherein the silicon-based parts comprise two silicon bases and at least three silicon legs having opposed ends bonded to the bases by the composite and including a plurality of teeth formed in the legs to support a plurality of wafers in parallel orientation.

6. The assembly of claim 1, wherein the silicon parts are made of virgin polysilicon.

7. The assembly of claim 1, wherein at least one of the silicon-based parts is selected from the group consisting of cast silicon, virgin polysilicon, Czochralski-grown silicon, quartz, silicon carbide, and silicon-impregnated silicon carbide.

8. A method of making the joined silicon assembly of claim 1 the method comprising the steps of:

providing a composite for bridging interior portions of the gap to adhere the at least two silicon-based parts together, the composite comprising a plurality of silicon crystallites having at least interiors consisting essentially of silicon, the plurality of silicon crystallites being embedded in a matrix of silica, wherein the parts are capable of being free standing when not adhered together by the composite, wherein the diameter of the plurality of silicon crystallites is less than the size of the gap, and wherein the mixture vitrifies to form a silicate glass when annealed to an annealing temperature;

applying the mixture to at least one of the joining areas;

assembling the at least two silicon-based parts with the respective joining areas separated by a gap of about 50 μ

m or more in juxtaposition; and

annealing the assembled at least two silicon-based parts at the annealing temperature to thereby bond the at least two silicon-based parts together.

9. The assembly of claim 8, wherein the at least two silicon parts include two silicon bases and at least three silicon legs bonded on ends thereof to the silicon bases and including teeth formed therein for supporting a plurality of substrates in a stacked arrangement.

10. The assembly of claim 8, wherein the at least two silicon-based parts are made of virgin polysilicon.

11. A joined silicon assembly, comprising:

at least two virgin polysilicon parts juxtaposed across a pair of joining areas separated by a gap; and

a composite filled into the gap, bonding the silicon parts together, and comprising silicon particles and

a silica network in which the silicon particles are dispersed,

wherein the parts are capable of being free-standing when not bonded together by the composite.

12. The assembly of claim 11, wherein the silicon particles have sizes of less than 100 μ

m.

13. The assembly fixture of claim 11, wherein the silicon particles have at least interiors consisting essentially of silicon.

14. The assembly of claim 11, wherein the silica network is formed from a silica bridging agent which is a silicon-containing material.

15. The assembly of claim 11, wherein the silica network is formed from a silica bridging agent which is a spin-on glass.

16. The assembly of claim 11, wherein 99% of the silicon particles have a size of less than 100 nm.

17. The assembly of claim 11, wherein the silicon particles have a size distribution with a median size in a range of 10 to 25 nm.