Method for removing electricity and method for manufacturing semiconductor device
First Claim
1. A method for removing electricity, comprising the steps of:
- placing a substrate provided with a thin film transistor in a tray body;
placing a tray cover over the tray body so that the substrate provided with the thin film transistor is surrounded therein; and
performing a heat treatment to suppress presence of a static charge at a surface of the substrate provided with the thin film transistor or suppress generation of a static charge which is caused by wind,wherein each of the tray body and the tray cover contains a conductive material,wherein a combination of the tray body and the tray cover constitutes a conductive storage container, andwherein at least one of the tray body and the tray cover has a depressed surface which has a larger area than the substrate.
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Accused Products
Abstract
An object is to suppress a significant change in electrical characteristics of thin film transistors and a deviation thereof from the designed range due to static electricity, and to improve the yield in manufacturing semiconductor devices. In order to prevent a substrate from being charged with static electricity by heat treatment or to favorably reduce static electricity with which a substrate is charged in a manufacturing process of a semiconductor device, heat treatment is performed with a substrate provided with a thin film transistor stored in a conductive container. In addition, a heating apparatus for performing the heat treatment is electrically connected to a ground potential, and the container and the substrate are also electrically connected to the ground potential.
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Citations
9 Claims
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1. A method for removing electricity, comprising the steps of:
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placing a substrate provided with a thin film transistor in a tray body; placing a tray cover over the tray body so that the substrate provided with the thin film transistor is surrounded therein; and performing a heat treatment to suppress presence of a static charge at a surface of the substrate provided with the thin film transistor or suppress generation of a static charge which is caused by wind, wherein each of the tray body and the tray cover contains a conductive material, wherein a combination of the tray body and the tray cover constitutes a conductive storage container, and wherein at least one of the tray body and the tray cover has a depressed surface which has a larger area than the substrate. - View Dependent Claims (2)
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3. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a thin film transistor including an oxide semiconductor layer over a substrate; placing the substrate provided with the thin film transistor including the oxide semiconductor layer in a tray body; placing a tray cover over the tray body so that the substrate provided with the thin film transistor including the oxide semiconductor layer is surrounded therein; and performing a heat treatment with the substrate provided with the thin film transistor including the oxide semiconductor layer surrounded with the tray body and the tray cover, wherein each of the tray body and the tray cover contains a conductive material, wherein a combination of the tray body and the tray cover constitutes a conductive storage container, and wherein at least one of the tray body and the tray cover has a depressed surface which has a larger area than the substrate. - View Dependent Claims (4, 5)
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6. A method for removing electricity, comprising the steps of:
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wrapping a substrate provided with a thin film transistor in metal foil; and performing a heat treatment to suppress presence of a static charge at a surface of the substrate provided with the thin film transistor or suppress generation of a static charge which is caused by wind.
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7. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a thin film transistor including an oxide semiconductor layer over a substrate; and performing a heat treatment with the substrate provided with the thin film transistor wrapped in conductive metal foil. - View Dependent Claims (8, 9)
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Specification