Semiconductor light-emitting device
First Claim
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1. A semiconductor light-emitting device, comprising:
- a plurality of compound semiconductor layers comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer;
an electrode on the plurality of compound semiconductor layers;
an electrode layer comprising a reflective material under the plurality of compound semiconductor layers;
an oxide or nitride based channel layer around between the electrode layer and the plurality of compound semiconductor layers; and
a conductive support member under the electrode layer,wherein the conductive support member comprises an alloy material with a thermal expansion coefficient of about 1˜
9×
10−
6/K,wherein the conductive support member is formed of a Ni-alloy layer containing at least one element selected from the group consisting of Cr, Fe, Si, and Mo, andwherein an inside portion of the channel layer is disposed under the plurality of compound semiconductor layers, and an outside portion of the channel layer has a different thickness from the inside portion of the channel layer and is exposed to an outside of the plurality of compound semiconductor layers.
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Abstract
A semiconductor light-emitting device is provided. The semiconductor light-emitting device comprises a plurality of compound semiconductor layers, an electrode layer, and a conductive support member. The compound semiconductor layers comprise a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer. The electrode layer is disposed under the compound semiconductor layers. The conductive support member is disposed under the electrode layer. Herein, the conductive support member has a thermal expansion coefficient difference within about 50% with respect to the compound semiconductor layer.
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10 Claims
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1. A semiconductor light-emitting device, comprising:
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a plurality of compound semiconductor layers comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; an electrode on the plurality of compound semiconductor layers; an electrode layer comprising a reflective material under the plurality of compound semiconductor layers; an oxide or nitride based channel layer around between the electrode layer and the plurality of compound semiconductor layers; and a conductive support member under the electrode layer, wherein the conductive support member comprises an alloy material with a thermal expansion coefficient of about 1˜
9×
10−
6/K,wherein the conductive support member is formed of a Ni-alloy layer containing at least one element selected from the group consisting of Cr, Fe, Si, and Mo, and wherein an inside portion of the channel layer is disposed under the plurality of compound semiconductor layers, and an outside portion of the channel layer has a different thickness from the inside portion of the channel layer and is exposed to an outside of the plurality of compound semiconductor layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification