Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof
First Claim
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1. A method for manufacturing an integrated circuit package system comprising:
- connecting an integrated circuit to a leadfinger;
forming an insulating compound having an insulation step directly on the leadfinger and the integrated circuit;
providing a selectively exposed area exposed by the insulating compound andcoating a conductive shielding layer on the insulating compound with the insulation step between the conductive shielding layer and an end of the leadfinger with the conductive shielding layer electrically connected to the selectively exposed area.
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Abstract
A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
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Citations
18 Claims
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1. A method for manufacturing an integrated circuit package system comprising:
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connecting an integrated circuit to a leadfinger; forming an insulating compound having an insulation step directly on the leadfinger and the integrated circuit; providing a selectively exposed area exposed by the insulating compound and coating a conductive shielding layer on the insulating compound with the insulation step between the conductive shielding layer and an end of the leadfinger with the conductive shielding layer electrically connected to the selectively exposed area. - View Dependent Claims (2, 3, 4, 5)
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6. A method for manufacturing an integrated circuit package system comprising:
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connecting an integrated circuit to a leadfinger; forming an insulating compound having an insulation step directly on the leadfinger and the integrated circuit; providing a selectively exposed area exposed by the insulating compound; coating a conductive shielding layer on the insulating compound with the insulation step between the conductive shielding layer and an end of the leadfinger with the conductive shielding layer electrically connected to the selectively exposed area; and providing a selectively exposed lead exposed by the insulating compound and electrically connected to the conductive shielding layer. - View Dependent Claims (7, 8, 9)
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10. An integrated circuit package system comprising:
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an integrated circuit; a leadfinger electrically connected to the integrated circuit; an insulating compound having an insulation step directly on the leadfinger, the insulating compound on the integrated circuit; a selectively exposed area exposed by the insulating compound; and a conductive shielding layer on the insulating compound having the insulation step between the conductive shielding layer and an end of the leadfinger with the conductive shielding layer electrically connected to the selectively exposed area. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification