Vertical system integration
First Claim
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1. A stacked integrated circuit comprising:
- a plurality of closely-coupled integrated circuit layers in stacked relation to one another,at least one of the plurality of closely-coupled integrated circuit layers having a predetermined interconnection pattern;
wherein there exists at least one additional completed integrated circuit layer, different than each of the plurality of closely-coupled integrated circuit layers, having the predetermined interconnection pattern, whereby the additional completed integrated circuit layer, without modification, could have been added to the stacked integrated circuit.
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Abstract
The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.
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Citations
10 Claims
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1. A stacked integrated circuit comprising:
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a plurality of closely-coupled integrated circuit layers in stacked relation to one another, at least one of the plurality of closely-coupled integrated circuit layers having a predetermined interconnection pattern; wherein there exists at least one additional completed integrated circuit layer, different than each of the plurality of closely-coupled integrated circuit layers, having the predetermined interconnection pattern, whereby the additional completed integrated circuit layer, without modification, could have been added to the stacked integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification