Semiconductor chip assembly with post/base heat spreader and signal post
First Claim
Patent Images
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes first and second openings;
a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and
a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;
wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, contacts the posts, the base and the terminal and extends laterally from the thermal post to or beyond the terminal;
wherein the pad extends above the posts and the adhesive and the terminal extends below the posts; and
wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another between top and bottom surfaces of the pad and are the same metallic material as one another, and the base and the terminal have the same thickness and are coplanar with one another below the posts and are the same metallic material as one another.
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Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.
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Citations
60 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post; wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the posts, the base and the terminal and extends laterally from the thermal post to or beyond the terminal; wherein the pad extends above the posts and the adhesive and the terminal extends below the posts; and wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another between top and bottom surfaces of the pad and are the same metallic material as one another, and the base and the terminal have the same thickness and are coplanar with one another below the posts and are the same metallic material as one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad, a terminal, a routing line and a signal post, wherein the routing line is adjacent to the pad and the signal post and overlaps the signal post, the signal post is adjacent to and integral with the terminal, extends below the pad and the routing line and extends above the terminal, the terminal covers the signal post in the downward direction and extends laterally from the signal post in the lateral directions and an electrically conductive path between the pad and the terminal includes the routing line and the signal post; wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the posts, the base and the terminal, covers and surrounds the posts in the lateral directions, extends laterally from the thermal post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the pad extends above the posts and the adhesive; and wherein the thermal post fills and is contained within the first opening, the signal post fills and is contained within the second opening, the posts have the same thickness and are coplanar with one another and with the adhesive between top and bottom surfaces of the pad and are a metal, and the base and the terminal have the same thickness and are coplanar with one another below the posts and the adhesive and are the same metallic material and include the metal. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate; and a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post; wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends through a first gap in the first aperture between the thermal post and the substrate and through a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, contacts the thermal post and the dielectric layer in the first gap, contacts the signal post and the dielectric layer in the second gap, contacts the base, the terminal and the dielectric layer outside the gaps, extends laterally from the thermal post to or beyond the terminal and is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer and between the base and the dielectric layer; wherein the substrate is mounted on the adhesive and extends above the base; wherein the pad extends above the posts, the adhesive and the dielectric layer; and wherein the thermal post extends into the first opening and the first aperture and above and below the dielectric layer, the signal post extends into the second opening and the second aperture and above and below the dielectric layer, the posts have the same thickness and are coplanar with one another between top and bottom surfaces of the pad and are the same metallic material as one another, the base and the terminal have the same thickness and are coplanar with one another below the posts, the adhesive and the dielectric layer and are the same metallic material as one another, and the base extends below the semiconductor device and the pad. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post, a base and a cap, wherein the thermal post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post; a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate; a conductive trace that includes a pad, a routing line, a terminal and a signal post, wherein the routing line is adjacent to the pad and the signal post and overlaps the signal post, the signal post is adjacent to and integral with the terminal, extends below the pad and the routing line and extends above the terminal, the terminal covers the signal post in the downward direction and extends laterally from the signal post in the lateral directions and an electrically conductive path between the pad and the terminal includes the routing line and the signal post; wherein the semiconductor device is mounted on the cap, overlaps the thermal post, does not overlap the signal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends through a first gap in the first aperture between the thermal post and the substrate and through a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, contacts the thermal post and the dielectric layer in the first gap, contacts the signal post and the dielectric layer in the second gap, contacts the base, the terminal and the dielectric layer outside the gaps, is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer and between the base and the dielectric layer, covers and surrounds the posts in the lateral directions, extends laterally from the thermal post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the pad extends above the posts, the adhesive and the dielectric layer; and wherein the thermal post fills and is contained within the first opening and extends through the first aperture, the signal post fills and is contained within the second opening and extends through the second aperture, the thermal post and the adhesive in combination fill the first aperture, the signal post and the adhesive in combination fill the second aperture, the cap contacts and overlaps the adhesive, the routing line contacts and overlaps the adhesive and the dielectric layer, the posts have the same thickness and are coplanar with one another and with the adhesive between top and bottom surfaces of the pad and are a metal, the base and the terminal have the same thickness and are coplanar with one another and extend below the posts, the adhesive and the dielectric layer and are the same metallic material and are primarily the metal, and the base extends below the semiconductor device and the pad. - View Dependent Claims (47, 48, 49, 50)
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51. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes first and second openings; a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction, covers the thermal post in the downward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post is adjacent to and integral with the terminal and extends below the pad and above the terminal, the terminal extends laterally from the signal post and an electrically conductive path between the pad and the terminal includes the signal post; wherein the semiconductor device is mounted on the heat spreader, overlaps the thermal post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the posts, the base, and the terminal and extends laterally from the thermal post to or beyond the terminal; wherein the pad extends above the posts and the adhesive and the terminal extends below the posts and the adhesive; and wherein the thermal post fills and is contained within the first opening, the signal post fills and is contained within the second opening, the posts have the same thickness and are coplanar with one another and with the adhesive between top and bottom surfaces of the pad and are a metal, the base and the terminal have the same thickness and are coplanar with one another below the posts and the adhesive and are the same metallic material and include the metal where they contact the adhesive, and the base extends below the semiconductor device and the pad. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58, 59, 60)
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Specification