Method and system for inter-chip communication via integrated circuit package waveguides

• US 8,269,344 B2
• Filed: 03/28/2008
• Issued: 09/18/2012
• Est. Priority Date: 03/28/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US12/058,423
• Publication Number:
  US 20090245808A1
• Time in Patent Office: 1,635 Days
• Field of Search: 257/431, 257/461, 257/728, 257/E23.002, 333/105, 333/108
• US Class Current: 257/728
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6688 Mixed frequency adaptations, i.e. for operation at different frequencies
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/92 Specific sequence of method steps
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/1903 : including wave guides
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

Methods and systems for inter-chip communication via integrated circuit package waveguides are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more waveguides integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

in a multi-layer package with one or more electrical waveguides integrated therein, and a plurality of chips bonded to said multi-layer package, wherein said one or more electrical waveguides are outside of said plurality of chips, and when said plurality of chips are bonded to said multi-layer package, said one or more electrical waveguides integrated in said multi-layer package provide interconnections between said plurality of chips;

communicating one or more electrical signals between or among said plurality of chips via said one or more electrical waveguides integrated in said multi-layer package.

2. The method according to claim 1, comprising configuring said one or more electrical waveguides via switches integrated within each of said plurality of chips.

3. The method according to claim 1, comprising configuring said one or more electrical waveguides via MEMS switches integrated in said multi-layer package.

4. The method according to claim 1, wherein said one or more electrical signals comprises a microwave signal.

5. The method according to claim 1, comprising configuring said communication of said one or more electrical signals via a low frequency control signal.

6. The method according to claim 5, wherein said low frequency control signal comprises a digital signal.

7. The method according to claim 1, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package.

8. The method according to claim 1, wherein said one or more electrical waveguides comprise semiconductor layers embedded within said multi-layer package.

9. A system for wireless communication, the system comprising:

one or more circuits enabling communication of one or more electrical signals between or among each of a plurality of chips via one or more electrical waveguides integrated in said multi-layer package, wherein said one or more electrical waveguides are outside of said plurality of chips, and when said plurality of chips are bonded to said multi-layer package, said one or more electrical waveguides integrated in said multi-layer package provide interconnections between said plurality of chips.

10. The system according to claim 9, wherein said one or more circuits enables configuration of said one or more electrical waveguides via switches integrated within each of said plurality of chips.

11. The system according to claim 9, wherein said one or more circuits enables configuration of said one or more electrical waveguides via MEMS switches integrated in said multi-layer package.

12. The system according to claim 9, wherein said one or more electrical signals comprises a microwave signal.

13. The system according to claim 9, wherein said one or more circuits enables configuration of said communication of said one or more electrical signals via a low frequency control signal.

14. The system according to claim 13, wherein said low frequency control signal comprises a digital signal.

15. The system according to claim 9, wherein said one or more electrical waveguides comprise metal layers deposited on said multi-layer package.

16. The system according to claim 9, wherein said one or more electrical waveguides comprise semiconductor layers deposited on said multi-layer package.

17. A method comprising:

providing a multi-layer package with one or more electrical waveguides integrated therein;

bonding a plurality of chips to said multi-layer package;

wherein said one or more electrical waveguides are outside of said plurality of chips, and when said plurality of chips are bonded to said multi-layer package, said one or more electrical waveguides integrated in said multi-layer package provide interconnections between said plurality of chips.

18. The method according to claim 17 further comprising:

depositing metal layers in said multi-layer package to form said one or more electrical waveguides.

19. The method according to claim 17 further comprising:

depositing semiconductor layers in said multi-layer package to form said one or more electrical waveguides.