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Method and system for inter-chip communication via integrated circuit package waveguides

  • US 8,269,344 B2
  • Filed: 03/28/2008
  • Issued: 09/18/2012
  • Est. Priority Date: 03/28/2008
  • Status: Active Grant
First Claim
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1. A method for wireless communication, the method comprising:

  • in a multi-layer package with one or more electrical waveguides integrated therein, and a plurality of chips bonded to said multi-layer package, wherein said one or more electrical waveguides are outside of said plurality of chips, and when said plurality of chips are bonded to said multi-layer package, said one or more electrical waveguides integrated in said multi-layer package provide interconnections between said plurality of chips;

    communicating one or more electrical signals between or among said plurality of chips via said one or more electrical waveguides integrated in said multi-layer package.

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